APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
1 . An apparatus for manufacturing a light emitting diode (LED) package, the apparatus comprising:
a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame;
a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and
a cutting unit cutting an LED package determined to be a functional product or an LED package determined to be a defective product according to the testing results of the testing unit so as to be removed from the lead frame.
2 . The apparatus of claim 1 , wherein the heating unit comprises:
a low temperature heating unit heating the LED package array in a first temperature range; and
a high temperature heating unit heating the LED package array, which has been heated by the low temperature heating unit, in a second temperature range higher than the first temperature range.
3 . The apparatus of claim 1 , wherein the heating unit heats the LED package array as a testing target to 80° C. to 300° C.
4 . The apparatus of claim 1 , wherein the heating unit heat the LED package array as a testing target to 180° C. to 250° C.
5 . The apparatus of claim 1 , wherein the testing unit comprises a multi-probe pin array for simultaneously applying a driving voltage or current to the plurality of LED packages in the LED package array.
6 . The apparatus of claim 1 , wherein the testing unit tests the operational state of the LED package by simultaneously applying a driving voltage or current to the plurality of LED packages in the LED package array.
7 . The apparatus of claim 1 , wherein the testing unit tests whether or not each of the LED packages is open or short or lighted by applying a driving voltage or current to the plurality of LED packages in the LED package array.
8 . The apparatus of claim 1 , wherein the testing unit further comprises:
a camera for checking whether or not each of the LED packages in the LED package array is lighted.
9 . The apparatus of claim 1 , further comprising:
a loading unit supplying a testing target LED package array from the exterior to the heating unit; and
an unloading unit unloading the LED package array from the cutting unit.
10 . A method for manufacturing a light emitting diode (LED) package, the method comprising:
preparing an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame;
heating the LED package array;
testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and
cutting an LED package determined to be a functional product or an LED package determined to be a defective product according to the operational state testing results so as to be removed from the lead frame.
11 . The method of claim 10 , further comprising:
inspecting an external appearance of the LED package array before heating the LED package array.
12 . The method of claim 10 , wherein the heating of the LED package array comprises:
a low temperature heating operation of heating the LED package array in a first temperature range; and
a high temperature heating operation of heating the LED package array, which has been heated in the low temperature heating step, in a second temperature range higher than the first temperature range.
13 . The method of claim 10 , wherein, in the heating of the LED package array, the LED package array as a testing target is heated to 80° C. to 300° C.
14 . The method of claim 10 , wherein, in the heating of the LED package array, the LED package array as a testing target is heated to 180° C. to 250° C.
15 . The method of claim 10 , wherein, in the testing of the operational state of the LED packages, the operational state of the LED packages in the LED package array is tested by simultaneously applying a driving voltage or current to the plurality of LED packages through a multi-probe pin array.
16 . The method of claim 10 , wherein, in the testing of the operational state of the LED packages, the operational state of the LED packages in the LED package array is tested by simultaneously applying a driving voltage or current to the plurality of LED packages.
17 . The method of claim 10 , wherein, in the testing of the operational state of the LED packages, whether or not the respective LED packages are open or short or lighted is tested by simultaneously applying a driving voltage or current to the plurality of LED packages.
18 . The method of claim 10 , wherein, in the testing of the operational state of the LED packages, whether or not the respective LED packages in the LED package array are lighted is tested by using a camera.
19 . The method of claim 10 , further comprising:
a loading operation of supplying the testing target LED package array to a heating unit from the exterior; and
an unloading operation of unloading the LED package array which has undergone a cutting and removing step.
20 . The method of claim 10 , wherein each of the LED packages in the LED package array as a testing target is a package which has completely undergone a transparent resin applying process and a transparent resin curing process.