IP Library Patent Application 13279510
Patent Application
App. No. 13/279,510

Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof

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Quick Facts
Patent No.
US None
App. No.
13/279,510
Abstract

An epoxy resin represented by general formula (I) satisfying numerical formula (1) with hydrolytic halogen of 0.05 wt. % or less, said epoxy resin produced as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. 0.5≦ X/Y ≦1.5  Numerical formula (1)

Claims (11)

1 . An epoxy resin represented by general formula (I), which satisfies numerical formula (1) mentioned below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 1.03 to 1.10 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours.

wherein n is an integer of 0 or more;

A 1 and A 2 are residue of divalent phenol, and can be same or different;

both R 1 and R 2 are H or

0.5 ≦X/Y≦ 1.5  Numerical formula (1)

wherein,

X: epoxy equivalent (g/eq);

Y: phenolic hydroxyl group equivalent (g/eq).

2 . The epoxy resin of claim 1 wherein divalent phenols is bisphenols.

3 . The epoxy resin of claim 1 wherein epoxy equivalent of the resin is 3000 g/eq or less and phenolic hydroxyl group equivalent of the resin is 5000 g/eq or less.

4 . An epoxy resin composition comprising, containing epoxy resin according to claim 1 as an essential component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2012
From: HANAFUSA, MASAYOSHI; SHINOHARA, SHUYA; PARK, CHONGSOO; PARK, KYUNGHO; BAE, DEUK-SUNG; LEE, SEOK
To: KUKDO CHEMICAL CO., LTD
Reel/Frame 027491/0594 →