IP Library Granted Patent US 8,850,494
Granted Patent B2
US 8,850,494 · App. 13/279,733 · Granted Sep 30, 2014

Forming die assembly for microcomponents

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Quick Facts
Patent No.
US 8,850,494
App. No.
13/279,733
Granted
Sep 30, 2014
Kind
B2
Abstract

A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with an outer die, an inner die, a storage portion formed at the inner die, and a punch hole formed at the inner die. The inner die slidably inserted into the outer die forms a part of a cavity between the inner die and the outer die. The storage portion stores a raw material with a metal powder and a binder having plasticity. The punch hole connects the cavity and the storage portion and forms a gate therebetween. The plunger slidably inserted into the storage portion fills the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger, and it closes the gate and compresses the raw material in the cavity.

Claims (7)

1. A forming die assembly for microcomponents, comprising:

a forming die formed with an outer die, an inner die, a storage portion formed at the inner die, and a punch hole formed at the inner die, the inner die being formed so as to be slidably inserted into the outer die and to form at least a part of a cavity between the inner die and the outer die, the storage portion being used to store a raw material with a metal powder and a binder having plasticity, and the punch hole connecting the cavity and the storage portion so as to form a gate therebetween;

a plunger formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole; and

a punch slidably inserted into the plunger in the sliding direction of the plunger and opening and closing the gate by reciprocatory sliding, the punch closing the gate and compressing the raw material in the cavity into a green compact by sliding in the direction of the cavity.

2. The forming die assembly for microcomponents according to claim 1 , wherein the forming die is provided with an upper die and a lower die which are arranged so that they can relatively vertically make contact with each other and separate from each other, one of the upper die and the lower die is provided with the outer die and the inner die, and the cavity is formed when the upper die and the lower die are brought into contact with each other.

3. The forming die assembly for microcomponents according to claim 1 , wherein the green compact has a flange portion and a shaft portion, and the shaft portion projects from the flange portion.

4. The forming die assembly for microcomponents according to claim 1 , wherein the forming die is provided with a heating means for heating the raw material in the storage portion.

Assignments (6)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 13, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063069/0417 →
MERGER Recorded Mar 10, 2023
From: HITACHI POWDERED METALS CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 063052/0251 →
CHANGE OF NAME Recorded Mar 10, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063052/0885 →
MERGER Recorded Mar 9, 2023
From: HITACHI POWDERED METALS CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 062930/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2011
From: MURASUGI, NARUTOSHI; MAEKAWA, KAZUNORI; ISHIJIMA, ZENZO
To: HITACHI POWDERED METALS CO., LTD.
Reel/Frame 027120/0094 →