Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder
View Patent ↗A molding, produced by a layer-by-layer process in which regions of respective polymer pulverulent layers are selectively melted via introduction of electromagnetic energy, where the process employs a powder which comprises at least one homopolyamide prepared via polycondensation of diamines and dicarboxylic acids, wherein the homopolyamide has an enthalpy of fusion of at least 125 J/g and a recrystallization temperature of at least 148° C.
1. A molding, produced by a layer-by-layer process in which regions of respective polymer pulverulent layers are selectively melted via introduction of electromagnetic energy, which comprises employing a powder which comprises at least one homopolyamide prepared via polycondensation of diamines and dicarboxylic acids, wherein the homopolyamide has an enthalpy of fusion of at least 125 J/g and a recrystallization temperature of at least 148° C.
2. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of a diamine from the group of butanediamine, hexamethylenediamine, decane-diamine, 1,12-diaminododecane, and of a dicarboxylic acid from the group of adipic acid, azelaic acid, sebacic acid, dodecanedioic acid, brassylic acid, tetradecanedioic acid, pentadecanedioic acid, octadecanedioic acid.
3. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of decanediamine and sebacic acid (PA1010).
4. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of decanediamine and dodecanedioic acid (PA1012).
5. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of hexamethylenediamine and dodecanedioic acid (PA612).
6. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of hexamethylenediamine and sebacic acid (PA610).
7. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of 1,12-diaminododecane and dodecanedioic acid (PA1212).
8. The molding as claimed in claim 1 , which comprises at least one homopolyamide prepared via polycondensation of hexamethylenediamine and brassylic acid (PA613).
9. The molding as claimed in claim 1 , which comprises polyamide powder which has been obtained via precipitative crystallization.
10. The molding as claimed in claim 1 , which comprises a homopolyamide with a solution viscosity of from 1.4 to 2.1.
11. The molding as claimed in claim 1 , which comprises a homopolyamide with a solution viscosity of from 1.5 to 1.9.
12. The molding as claimed in claim 1 , which comprises a homopolyamide with a solution viscosity of from 1.6 to 1.7.
13. The molding as claimed in claim 1 , which comprises auxiliaries and/or fillers.
14. The molding as claimed in claim 1 , which comprises powder-flow aids as an auxiliary.
15. The molding as claimed in claim 1 , which comprises glass particles as filler.
16. The molding as claimed in claim 1 , which comprises metal soaps as an auxiliary.
17. The molding as claimed in claim 1 , which comprises organic and/or inorganic pigments.
18. The molding as claimed in claim 1 , which comprises carbon black.
19. The molding as claimed in claim 1 , which comprises titanium dioxide.