IP Library Granted Patent US 8,485,698
Granted Patent B2
US 8,485,698 · App. 13/281,430 · Granted Jul 16, 2013

Heat pipe, heat dissipating module and illumination device

Inventors: Chia-Chun Cheng (New Taipei, TW); Lei-Lei Liu (New Taipei, TW)
Assignee: Cooler Master Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,485,698
App. No.
13/281,430
Granted
Jul 16, 2013
Kind
B2
Abstract

A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.

Claims (40)

1. A heat dissipating module comprising:

a first heat conducting plate;

a second heat conducting plate disposed opposite to the first heat conducting plate;

at least one heat pipe, each of the at least one heat pipe comprising:

a first fixing portion positioned on the first heat conducting plate;

a first curved portion curved and extended from the first fixing portion;

a second fixing portion positioned on the second heat conducting plate;

a second curved portion curved and extended from the second fixing portion, at least parts of the first curved portion and at least parts of the second curved portion being not coplanar; and

a connecting portion connected between the first curved portion and the second curved portion;

a support member disposed between the first heat conducting plate and the second heat conducting plate; and

a first resilient member disposed on the support member, wherein the support member has a first stop portion, one end of the first resilient member abuts against the first stop portion and another end of the first resilient member abuts against the first heat conducting plate.

2. The heat dissipating module of claim 1 , wherein a projection of the first curved portion and a projection of the second curved portion are staggered along a direction from the first fixing portion toward the second fixing portion.

3. The heat dissipating module of claim 1 , wherein the connecting portion is straight-shaped or arc-shaped.

4. The heat dissipating module of claim 1 , wherein the first curved portion and the second curved portion are spiral-shaped.

5. The heat dissipating module of claim 1 , further comprising a second resilient member disposed on the support member, wherein the support member has a second stop portion opposite to the first stop portion, one end of the second resilient member abuts against the second stop portion and another end of the second resilient member abuts against the second heat conducting plate.

6. The heat dissipating module of claim 1 , wherein the first heat conducting plate has at least one first groove, the second heat conducting plate has at least one second groove, the first fixing portion is positioned in the first groove correspondingly, and the second fixing portion is positioned in the second groove correspondingly.

7. The heat dissipating module of claim 1 , wherein the first heat conducting plate has at least one first hole, the second heat conducting plate has at least one second hole, the first fixing portion is positioned in the first hole correspondingly, and the second fixing portion is positioned in the second hole correspondingly.

8. The heat dissipating module of claim 1 , wherein the first fixing portion and the second fixing portion are positioned on a surface of the first heat conducting plate and a surface of the second heat conducting plate respectively.

9. The heat dissipating module of claim 1 , wherein the first heat conducting plate comprises a first sub-heat conducting plate and a second sub-heat conducting plate, at least one heat pipe is positioned between the first sub-heat conducting plate and the second heat conducting plate, and at least one heat pipe is positioned between the second sub-heat conducting plate and the second heat conducting plate.

10. An illumination device comprising:

a heat dissipating module comprising:

a first heat conducting plate;

a second heat conducting plate disposed opposite to the first heat conducting plate;

at least one heat pipe, each of the at least one heat pipe comprising:

a first fixing portion positioned on the first heat conducting plate;

a first curved portion curved and extended from the first fixing portion;

a second fixing portion positioned on the second heat conducting plate;

a second curved portion curved and extended from the second fixing portion, at least parts of the first curved portion and at least parts of the second curved portion being not coplanar; and

a connecting portion connected between the first curved portion and the second curved portion;

a support member disposed between the first heat conducting plate and the second heat conducting plate; and

a first resilient member disposed on the support member, wherein the support member has a first stop portion, one end of the first resilient member abuts against the first stop portion and another end of the first resilient member abuts against the first heat conducting plate;

a heat dissipating member disposed on the first heat conducting plate; and

a light emitting module disposed on the second heat conducting plate.

11. The illumination device of claim 10 , wherein the connecting portion is straight-shaped or arc-shaped.

12. The illumination device of claim 10 , wherein the first curved portion and the second curved portion are spiral-shaped.

13. The illumination device of claim 10 , wherein the heat dissipating module further comprises a second resilient member disposed on the support member, the support member has a second stop portion opposite to the first stop portion, one end of the second resilient member abuts against the second stop portion and another end of the second resilient member abuts against the second heat conducting plate.

14. The illumination device of claim 10 , wherein the first heat conducting plate has at least one first groove, the second heat conducting plate has at least one second groove, the first fixing portion is positioned in the first groove correspondingly, and the second fixing portion is positioned in the second groove correspondingly.

15. The illumination device of claim 10 , wherein the first heat conducting plate has at least one first hole, the second heat conducting plate has at least one second hole, the first fixing portion is positioned in the first hole correspondingly, and the second fixing portion is positioned in the second hole correspondingly.

16. The illumination device of claim 10 , wherein the first fixing portion and the second fixing portion are positioned on a surface of the first heat conducting plate and a surface of the second heat conducting plate respectively.

17. The illumination device of claim 10 , wherein the first heat conducting plate comprises a first sub-heat conducting plate and a second sub-heat conducting plate, at least one heat pipe is positioned between the first sub-heat conducting plate and the second heat conducting plate, and at least one heat pipe is positioned between the second sub-heat conducting plate and the second heat conducting plate.

Assignments (2)
CHANGE OF NAME Recorded Jan 18, 2014
From: COOLER MASTER CO., LTD.
To: COOLER MASTER DEVELOPMENT CORPORATION
Reel/Frame 032088/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: CHENG, CHIA-CHUN; LIU, LEI-LEI
To: COOLER MASTER CO., LTD.
Reel/Frame 027119/0427 →
Continuity (1)
Related Publication 20130107547A1 · May 2, 2013