IP Library › Granted Patent US 8,573,843
Granted Patent B2
US 8,573,843 · App. 13/282,043 · Granted Nov 5, 2013

Temperature measuring device

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Quick Facts
Patent No.
US 8,573,843
App. No.
13/282,043
Granted
Nov 5, 2013
Kind
B2
Abstract

Provided is a temperature measuring device capable of continuously measuring a body temperature without imposing a load on a subject or a measurer. The temperature measuring device includes: a temperature measuring unit ( 10, 210 ) to be attached to an object to be measured, including a temperature measuring unit-side temperature sensing element ( 21, 221 ) and a first coil ( 11, 211 ); and a power supplying unit ( 30, 230 ) including a second coil ( 31, 231 ), for supplying power to the temperature measuring unit ( 10, 210 ), in which the temperature measuring unit ( 10, 210 ) and the power supplying unit ( 30, 230 ) are formed integrally with each other.

Claims (47)

1. A temperature measuring device, comprising:

a temperature measuring unit to be attached to an object to be measured, comprising a temperature measuring unit-side temperature sensing element and a first coil; and

a power supplying unit comprising a second coil, the power supplying unit supplying power to the temperature measuring unit by supplying power from the second coil to the first coil using an induced electromotive force,

wherein the temperature measuring unit and the power supplying unit are formed integrally with each other.

2. The temperature measuring device according to claim 1 , wherein the temperature measuring unit and the power supplying unit are integrally formed via a heat insulating portion.

3. The temperature measuring device according to claim 2 , wherein the heat insulating portion and one of the temperature measuring unit and the power supplying unit are detachably attachable to each other.

4. The temperature measuring device according to claim 2 , wherein the power supplying unit is connected in a wired manner to a main body comprising a power source.

5. The temperature measuring device according to claim 2 , wherein the power supplying unit is integrated with a main body comprising a power source.

6. The temperature measuring device according to claim 1 , wherein:

the power supplying unit further comprises a power supplying unit-side temperature sensing element; and

the temperature measuring unit and the power supplying unit are stacked one on the other in a close contact state, and the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element are opposed to each other.

7. The temperature measuring device according to claim 6 , wherein the temperature measuring unit and the power supplying unit are detachably attachable to each other.

8. The temperature measuring device according to claim 6 , wherein the power supplying unit is connected to a main body comprising a power source.

9. The temperature measuring device according to claim 6 , wherein:

the temperature measuring unit-side temperature sensing element has at least a part covered with a first thermal resistor; and

the power supplying unit-side temperature sensing element has at least a part covered with a second thermal resistor.

10. The temperature measuring device according to claim 9 , wherein, in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the first thermal resistor and the second thermal resistor.

11. The temperature measuring device according to claim 10 , wherein:

the temperature measuring unit-side temperature sensing element is thermally coupled directly to a surface of the object to be measured; and

the power supplying unit-side temperature sensing element is thermally coupled to the object to be measured via the heat flow path.

12. The temperature measuring device according to claim 9 , wherein:

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element is exposed from the second thermal resistor; and

in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the first thermal resistor.

13. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element is exposed from the first thermal resistor; and

in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the second thermal resistor.

14. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element is exposed from the first thermal resistor;

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element is brought into contact with a third thermal resistor; and

in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the third thermal resistor.

15. The temperature measuring device according to claim 14 , wherein the third thermal resistor has a thermal conductivity higher than any one of thermal conductivities of the first thermal resistor and the second thermal resistor.

16. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element is brought into contact with a third thermal resistor;

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element is exposed from the second thermal resistor; and

in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the third thermal resistor.

17. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element is brought into contact with a first magnetic substance;

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element has a third thermal resistor and a second magnetic substance stacked one on the other; and

in said close contact state, the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the third thermal resistor.

18. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element has a concave portion formed by the first thermal resistor;

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element is brought into contact with a third thermal resistor comprising a convex portion that protrudes from the second thermal resistor; and

in said close contact state, the convex portion of the third thermal resistor is fitted into the concave portion of the first thermal resistor, and the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the third thermal resistor.

19. The temperature measuring device according to claim 9 , wherein:

a surface of the temperature measuring unit-side temperature sensing element which is opposed to the power supplying unit-side temperature sensing element has a concave portion formed by the first thermal resistor;

a surface of the power supplying unit-side temperature sensing element which is opposed to the temperature measuring unit-side temperature sensing element has a third thermal resistor and a first thermal conductor stacked one on another, and the stacked first thermal conductor comprises a convex portion that protrudes from the second thermal resistor; and

in said close contact state, the convex portion of the first thermal conductor is fitted into the concave portion of the first thermal resistor, and the temperature measuring unit-side temperature sensing element and the power supplying unit-side temperature sensing element have a heat flow path formed therebetween by the third thermal resistor and the first thermal conductor comprising the convex portion.

Assignments (2)
CHANGE OF NAME Recorded Jan 25, 2017
From: CITIZEN HOLDINGS CO., LTD.
To: CITIZEN WATCH CO., LTD.
Reel/Frame 041479/0804 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: TSUCHIDA, MASATO
To: CITIZEN HOLDINGS CO., LTD.
Reel/Frame 027126/0978 →