Driving Integrated Circuit and Display Apparatus Including the Same
A driving integrated circuit (driving IC) connected to a display panel by a chip on glass (COG) method includes a pair of bumps electrically coupled to a test pad of the display panel; a power source electrically coupled to a first bump of the pair of bumps; a circuit device electrically coupled between a ground terminal and a second bump of the pair of bumps; and a node measuring unit for measuring a voltage at a node between the second bump and the circuit device.
1 . A driving integrated circuit (driving IC) coupled to a display panel by a chip on glass (COG) method, the driving IC comprising:
a pair of bumps electrically coupled to a test pad of the display panel;
a power source electrically coupled to a first bump of the pair of bumps;
a circuit device electrically coupled between a ground terminal and a second bump of the pair of bumps; and
a node measuring unit for measuring a voltage at a node between the second bump and the circuit device.
2 . The driving IC of claim 1 , wherein the circuit device comprises a resistor.
3 . The driving IC of claim 2 , wherein the node measuring unit comprises an analog-to-digital (A/D) converter for measuring the voltage at the node and for converting the voltage into a digital value.
4 . The driving IC of claim 1 , wherein the circuit device comprises a capacitor.
5 . The driving IC of claim 4 , wherein the node measuring unit comprises:
a comparison unit for comparing the voltage at the node with a target voltage; and
a counter for counting a time elapsed for the voltage at the node to reach the target voltage.
6 . The driving IC of claim 1 , further comprising a register for storing the voltage.
7 . The driving IC of claim 1 , wherein the power source is electrically coupled to the first bump via a switch.
8 . The driving IC of claim 1 , wherein the power source is an internal voltage of the driving IC.
9 . The driving IC of claim 1 , further comprising:
a first switch electrically coupled between the power source and the first bump and
a second switch electrically coupled between the second bump and the circuit device,
wherein the first switch and the second switch are configured to time-divisionally electrically couple one or more pairs of bumps to one or more respective test pads.
10 . A display apparatus comprising:
a display panel comprising a test pad; and
a driving integrated circuit (driving IC) coupled to the display panel by a chip on glass (COG) method, configured to automatically measure a connection resistance due to the COG connection, and comprising:
a pair of bumps electrically coupled to the test pad;
a power source electrically coupled to a first bump of the pair of bumps;
a circuit device electrically coupled between a ground terminal and a second bump of the pair of bumps; and
a node measuring unit for measuring a voltage at a node between the second bump and the circuit device.
11 . The display apparatus of claim 10 , wherein the circuit device comprises a resistor.
12 . The display apparatus of claim 11 , wherein the node measuring unit comprises an analog-to-digital (ND) converter for measuring the voltage at the node and for converting the voltage into a digital value.
13 . The display apparatus of claim 10 , wherein the circuit device comprises a capacitor.
14 . The display apparatus of claim 13 , wherein the node measuring unit comprises:
a comparison unit for comparing the voltage at the node with a target voltage; and
a counter for counting a time elapsed for the voltage at the node to reach the target voltage.
15 . The display apparatus of claim 10 , wherein the driving IC further comprises a register for storing the voltage.
16 . The display apparatus of claim 10 , wherein the power source is electrically coupled to the first bump via a switch.
17 . The display apparatus of claim 10 , wherein the power source is an internal voltage of the driving IC.
18 . The display apparatus of claim 10 , wherein the circuit device is arranged in the driving IC.
19 . The display apparatus of claim 10 , wherein the circuit device is arranged on the display panel outside the driving IC.
20 . The display apparatus of claim 10 , wherein the driving IC further comprises:
a first switch between the power source and the first bump and
a second switch between the second bump and the circuit device,
wherein the first switch and the second switch are configured to time-divisionally electrically couple one or more pairs of bumps to one or more respective test pads.