Granted Patent B2

US 8,786,943 · App. 13/282,503 · Granted Jul 22, 2014

Abstract

Claims (29)

1. An imaging system having reduced susceptibility to thermally-induced stress birefringence, for projecting an image of an object plane onto a display surface, comprising:

imaging optics including relay optics that image the object plane onto an intermediate image plane and projection optics that image the intermediate image plane onto the display surface;

wherein one of either the relay optics or the projection optics is a reflective optical system that includes reflective optical elements, and the other of the relay optics or the projection optics is a refractive optical system having a negligible or low susceptibility to thermal stress birefringence, the refractive optical system including:

a first group of refractive lens elements located upstream from an aperture stop; and

a second group of refractive lens elements located downstream from the aperture stop;

wherein the refractive lens elements in the first and second groups of refractive lens elements that are immediately adjacent to the aperture stop are fabricated using optical materials having a negligible susceptibility to thermal stress birefringence as characterized by a thermal stress birefringence metric, and the other refractive lens elements in the first and second groups of refractive lens elements, that are not the refractive lens elements immediately adjacent to the aperture stop, are fabricated using optical materials having at most a moderate susceptibility to thermal stress birefringence as characterized by the thermal stress birefringence metric.

2. The imaging system of claim 1 wherein the thermal stress birefringence metric includes factors relating to a coefficient of thermal expansion of the optical material, a stress optical coefficient of the optical material and a light absorption coefficient of the optical material.

3. The imaging system of claim 2 wherein the thermal stress birefringence metric associated with a particular refractive lens element in the first and second groups of refractive lens elements further includes at least one additional factor relating to a modulus of elasticity of the optical material, a thermal conductivity of the optical material, a Poisson's ratio of the optical material, an optical power density in the optical material, a thickness of the particular refractive lens element or a clear aperture size of the particular refractive lens element.

4. The imaging system of claim 2 wherein the thermal stress birefringence metric is given by:

M 1 ′=ρκα.

where M 1 ′ is the thermal stress birefringence metric, ρ is the coefficient of thermal expansion, κ is the stress optical coefficient, and α is the light absorption coefficient.

5. The imaging system of claim 2 wherein the thermal stress birefringence metric is given by:

M 1 =ρκαE /( K ·(1−μ)).

where M 1 is the thermal stress birefringence metric, ρ is the coefficient of thermal expansion, κ is the stress optical coefficient, α is the light absorption coefficient, E is the modulus of elasticity, K is the thermal conductivity, and μ is Poisson's ratio.

6. The imaging system of claim 5 wherein the optical materials having a negligible susceptibility to thermal stress birefringence satisfy the condition that M 1 ≦0.1×10 6 W −1 and the optical materials having at most a moderate susceptibility to thermal stress birefringence satisfy the condition that M 1 ≦1.60×10 −6 W −1 .

7. The imaging system of claim 6 where all of the refractive lens elements in the first and second groups of refractive lens elements satisfy the condition that M 1 ≦0.80×10 −6 W −1 .

8. The imaging system of claim 6 where at least one of the refractive lens elements in the first and second groups of refractive lens elements is fabricated using an optical material where 0.8×10 −6 W −1 ≦M 1 ≦1.60×10 −6 W −1 .

9. The imaging system of claim 2 wherein the thermal stress birefringence metric associated with a particular refractive lens element in the first and second groups of refractive lens elements is given by:

M 2 =I 0 LρκαE /( K ·(1−μ)).

where M 2 is the thermal stress birefringence metric, I 0 is the optical power density in the optical material, L is the thickness of the particular refractive lens element, ρ is the coefficient of thermal expansion, κ is the stress optical coefficient, α is the light absorption coefficient, E is the modulus of elasticity, K is the thermal conductivity, and μ is Poisson's ratio.

10. The imaging system of claim 1 where the optical materials used to fabricate the refractive lens elements in the first and second groups of refractive lens elements are also selected in accordance with their refractive index and chromatic dispersion properties.

11. The imaging system of claim 1 wherein one or more surfaces of one or more of the refractive lens elements in the first and second groups of refractive lens elements or the reflective optical elements have an aspheric surface profile.

12. The imaging system of claim 1 wherein the reflective optical system includes at least two concentrically positioned reflective optical elements arranged in an Offner configuration.

13. The imaging optics of claim 1 wherein the reflective optical system include at least two reflective optical elements arranged in a telescopic imaging configuration.

14. The imaging system of claim 1 wherein the reflective optical system includes one or more off-axis reflective optical elements.

15. The imaging system of claim 1 wherein the reflective optical system has no central obscuration.

16. The imaging system of claim 1 wherein the reflective optical system includes at least one reflective optical element having an aspheric shape profile.

17. The imaging system of claim 16 wherein the aspheric shape profile is an elliptical shape profile, a hyperbolic shape profile, a parabolic shape profile, or a free-form shape profile.

18. The imaging system of claim 1 wherein the at least some of the optical materials used to fabricate the refractive lens elements are glasses or polymers.

Assignments (19)