Composite structures having improved heat aging and interlayer bond strength
View Patent ↗Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.
1. A composite structure comprising:
a first component comprising
a polyamide matrix resin composition comprising
from 0.1 to at or about 3 weight percent of a matrix heat stabilizer based on the weight of the polyamide matrix resin composition;
a fibrous material selected from woven or non-woven structures, felts, knits, braids, textiles, fibrous battings or mats, and combinations of these;
and
a polyamide surface resin composition comprising
0.1 to 3 weight percent of a copper based heat stabilizer based on the weight of the polyamide surface resin composition;
wherein:
the matrix heat stabilizer is not a copper based heat stabilizer and does not contain copper or copper ions:
the matrix heat stabilizer is a polyhydric alcohol selected from the group consisting of dipentaerythritol, tripentaerythritol, pentaerythritol, di-trimethylolpropane, D-mannitol, D-sorbitol, xylitol, and mixtures of these;
the fibrous material is impregnated with the polyamide matrix resin composition;
and
a second component comprising
a polyamide resin composition
and
optionally a reinforcing agent selected from glass fibers, carbon fibers, glass beads, and aramid fibers;
and overmolded onto said first component;
and wherein
the second component is adhered to the surface of the first component.
2. The composite structure of claim 1 wherein the first component and the second component after heat aging the composite structure for 120 hours at 150° C. in air, at least equal to that before heat aging.
3. The composite structure of claim 1 wherein the polyamide matrix resin composition and the polyamide resin composition of the second component are the same polyamides or different polyamides.
4. The composite structure of claim 1 wherein the polyamide in the matrix resin composition, the polyamide in the surface resin composition, and the polyamide in the second component polyamide resin composition are independently selected from the group consisting of PA6; PA11; PA12; PA4,6; PA6.6; PA,10; PA6,12; PA10,10; PA6T; PA6I, PA6I/6T; PA6,T/6,6; PAMXD6; PA6T/DT and copolymers and blends thereof.
5. The composite structure claim 1 wherein the matrix heat stabilizer is selected from dipentaerythritol, tripentaerythritol, pentaerythritol and mixtures of these.
6. The composite structure of claim 1 wherein the copper based heat stabilizer is a mixture of 10 to 50 weight percent copper halide, 50 to 90 weight percent potassium iodide, and from zero to 15 weight percent metal stearate.
7. The composite structure of claim 1 wherein the fibrous material is from 30 volume percent to 60 volume percent of the first component.
8. An article made from the composite structure of claim 1 .
9. The article of claim 8 in the form of components for automobiles, trucks, commercial airplanes, aerospace, rail, household appliances, computer hardware, hand held devices, recreation and sports, structural component for machines, structural components for buildings, structural components for photovoltaic equipment or structural components for mechanical devices.
10. The article of claim 8 in the form of automotive powertrain covers and housings, engine cover brackets, steering columns frame, oil pans, and exhaust system components.