IP Library Granted Patent US 8,907,042
Granted Patent B2
US 8,907,042 · App. 13/283,951 · Granted Dec 9, 2014

Polyetherimides, methods of manufacture, and articles formed therefrom

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Quick Facts
Patent No.
US 8,907,042
App. No.
13/283,951
Granted
Dec 9, 2014
Kind
B2
Abstract

A polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound of the formula MO—Z—OM wherein M is an alkali metal salt and Z is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide) of the formula less than 10 weight percent of a 3,4′-bis(halophthalimide) of the formula and from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide) of the formula

Claims (169)

1. A polymer composition comprising a polyetherimide of the formula

wherein

n is greater than 1,

each R is the same or different, and is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is 1 to 5, and a halogenated derivative thereof,

each Z is the same or different and is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof,

the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 4,3′, 3,4′ and 4,4′ positions; the divalent bonds of the —O—Z—O— group being made from a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide) of the formula

less than 10 weight percent of a 3,4′-bis(halophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide) of the formula

wherein each X is independently fluoro, chloro, bromo, or iodo and R is as defined above, and wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct, based on the total weight of the polyetherimide.

2. The polymer composition of claim 1 , wherein the polyetherimide is manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound of the formula

MO—Z—OM

wherein M is an alkali metal salt and Z is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof,

with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide) of the formula

less than 10 weight percent of a 3,4′-bis(halophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide) of the formula

wherein R is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q′ is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is 1 to 5, and a halogenated derivative thereof, further wherein

the polyetherimide is of the formula

wherein n is greater than 1, each R is the same or different, each Z is the same or different, and are as defined above, and the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 3,4′, 4,3′, and 4,4′ positions.

3. The composition of claim 1 , wherein the polyetherimide has

a heat deflection temperature of at least 218° C., determined by DMA on a film sample,

a heat deflection temperature at least 10° C. higher than a heat deflection temperature of the same polyetherimide manufactured using a bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined on a film sample,

at least 20% lower stiffness than the stiffness of the same polyetherimide manufactured using the bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined by DMA over 30° C. to 110° C. and on a film sample, and

a ratio of low shear rate viscosity to high shear rate viscosity that is at least 30% higher than the same ratio of the same polyetherimide manufactured using the same bis(halophthalimide) composition comprising 10 weight percent or more of the 3,4′-bis(halophthalimide) and more than 55 weight percent of the 4,4′-bis(halophthalimide), each determined by parallel plate rheometry.

4. The composition of claim 1 , wherein the polyetherimide comprises less than 3000 parts per million of a halide, based on the total parts of the polyetherimide.

5. The composition of claim 1 , wherein the bis(halophthalimide) composition comprises

from 45 to less than 55 weight percent of the (3,3′-bis(halophthalimide),

less than 10 weight percent of the 3,4′-bis(halophthalimide), and

from 45 to 55 weight percent of the 4,4′-bis(halophthalimide).

6. The composition of claim 1 , wherein Z is a divalent radical of the formula

wherein Q is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is an integer from 1 to 5, and a halogenated derivative thereof; and

R is a divalent group of formula

wherein Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, or —C y H 2y — wherein y is an integer from 1 to 5.

7. The composition of claim 6 , wherein Z is 2,2-(4-phenylene)isopropylidene and R is m-phenylene, p-phenylene, p-phenylene diarylsulfone, or a combination thereof.

8. The composition of claim 1 , further comprising an additive selected from impact modifiers, fillers, reinforcing agents, anti-oxidants, heat stabilizers, light stabilizers, ultraviolet light (UV) absorbers, plasticizers, lubricants, mold release agents, antistatic agents, colorants, blowing agents, flame retardants, anti-drip agents, and radiation stabilizers, and a combination thereof.

9. The composition of claim 1 , further comprising an additive selected from an antioxidant, a UV absorber, a mold release agent, and a combination thereof.

10. A polymer composition comprising a polyetherimide of the formula

wherein

n is greater than 1,

each R is the same or different, and is wherein R is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is 1 to 5, and a halogenated derivative thereof,

each Z is the same or different and is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof,

the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 3,4′, 4,3′, and 4,4′ positions; the divalent bonds of the —O—Z—O— group being made from a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide) of the formula

less than 10 weight percent of a 3,4′-bis(halophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide) of the formula

wherein R is as defined above, and

wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct, based on the total weight of the polyetherimide.

11. The polymer composition of claim 10 , wherein the polyetherimide is manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound of the formula

MO—Z—OM

wherein M is an alkali metal salt and Z is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof,

with a bis(chlorophthalimide) composition comprising, based on the weight of the bis(chlorophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(chlorophthalimide) of the formula

less than 10 weight percent of a 3,4′-bis(chlorophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a 4,4′-bis(chlorophthalimide) of the formula

wherein R is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is 1 to 5, and a halogenated derivative thereof, further wherein

the polyetherimide is of the formula

wherein n is greater than 1, each R is independently the same or different, each Z is independently the same or different, and are as defined above, and the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 3,4′, 4,3′, and 4,4′ positions.

12. The composition of claim 10 , wherein the polyetherimide has

a heat deflection temperature of at least 218° C., determined using DMA on a film sample,

a heat deflection temperature at least 10° C. higher than a heat deflection temperature of the same polyetherimide manufactured using a bis(chlorophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined by DMA on a film sample,

at least 20% lower stiffness than the stiffness of the same polyetherimide manufactured using the bis(chlorophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined by DMA over 30° C. to 110° C. on a film sample, and

a ratio of a low shear rate viscosity to a high shear rate viscosity that is at least 30% higher than the same ratio of the same polyetherimide manufactured using the bis(chlorophthalimide) composition comprising 10 weight percent or more of the 4,3′-bis(chlorophthalimide) and more than 55 weight percent of the 4,4′-bis(chlorophthalimide), each determined by parallel plate rheometry.

13. The composition of claim 10 , wherein the polyetherimide comprises less than 3000 parts per million of chloride, based on the total parts of the polyetherimide.

14. The composition of claim 11 , wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct of the alkali metal salt and the bis(halophthalimide), based on the total weight of the polyetherimide.

15. The composition of claim 11 , wherein the bis(chlorophthalimide) composition comprises

from 45 to 55 weight percent of the (3,3′-bis(chlorophthalimide),

less than 10 weight percent of the 4,3′-bis(chlorophthalimide), and

from 45 to 55 weight percent of the 4,4′-bis(chlorophthalimide).

16. The composition of claim 11 , wherein Z is a divalent radical of the formula

wherein Q is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is an integer from 1 to 5, and a halogenated derivative thereof; and

R is a divalent group of formula

wherein Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, or —C y H 2y — wherein y is an integer from 1 to 5.

17. The composition of claim 16 , wherein Z is 2,2-(4-phenylene)isopropylidene and R is m-phenylene, p-phenylene, p-phenylene diarylsulfone, or a combination thereof.

18. A method for the manufacture of the polyetherimide composition of claim 1 , the method comprising reacting, in the presence of a catalytically active amount of a phase transfer catalyst, an alkali metal salt of a dihydroxy aromatic compound of the formula

MO—Z—OM

wherein M is an alkali metal salt and Z is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, with

a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(halophthalimide) of the formula

less than 10 weight percent of a 4,3′-bis(halophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a (4,4′-bis(halophthalimide) of the formula

wherein each R is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is 1 to 5, and a halogenated derivative thereof, to form a polyetherimide of the formula

wherein n is greater than 1, each R is the same or different, each Z is the same or different, and are as defined above, and the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 3,4′, 4,3′, and 4,4′ positions, and wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct, based on the total weight of the polyetherimide.

19. The method of claim 18 , wherein the polyetherimide has

a heat deflection temperature of at least 218° C., determined by DMA on a film sample

a heat deflection temperature at least 10° C. higher than a heat deflection temperature of the same polyetherimide manufactured using a bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide), each determined DMA on a film sample,

at least 20% lower stiffness than the stiffness of the same polyetherimide manufactured using the bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide), each determined by DMA over 30° C. to 110° C., on a film sample, and

a ratio of a low shear rate viscosity to a high shear rate viscosity that is at least 30% higher than the same ratio of the same polyetherimide manufactured using the bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide) and more than 55 weight percent of the 4,4′-bis(halophthalimide), each determined by parallel plate rheometry.

20. The method of claim 18 , wherein

M is sodium,

Z is a divalent radical of the formula

wherein Q is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is an integer from 1 to 5, and a halogenated derivative thereof; and

R is a divalent group of formula

wherein Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, or —C y H 2y — wherein y is an integer from 1 to 5.

21. The method of claim 20 , wherein Z is 2,2-(4-phenylene)isopropylidene and R is m-phenylene, p-phenylene, p-phenylene diarylsulfone, or a combination thereof.

22. A method for the manufacture of a polyetherimide composition of claim 10 , the method comprising reacting, in the presence of a catalytically active amount of a phase transfer catalyst, an alkali metal salt of a dihydroxy aromatic compound of the formula

MO—Z—OM

wherein M is an alkali metal salt and Z is an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, with

a bis(chlorophthalimide) composition comprising, based on the weight of the bis(chlorophthalimide) composition,

from more than 45 to less than 75 weight percent of a 3,3′-bis(chlorophthalimide) of the formula

less than 10 weight percent of a 3,4′-bis(chlorophthalimide) of the formula

and

from more than 45 to less than 75 weight percent of a (4,4′-bis(chlorophthalimide) of the formula

wherein each R is selected from an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, and —C y H 2y — wherein y is 1 to 5 and a halogenated derivative thereof, to form a polyetherimide of the formula

wherein n is greater than 1, each R is the same or different, each Z is the same or different, and are as defined above, and the divalent bonds between the —O—Z—O— group and the phenyl substituents are in the 3,3′, 3,4′, 4,3′, and 4,4′ positions,

and

wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct, based on the total weight of the polyetherimide.

23. The method of claim 22 , wherein the polyetherimide has

a heat deflection temperature of at least 218° C., determined by DMA on a film sample

a heat deflection temperature at least 10° C. higher than the heat deflection temperature of the same polyetherimide manufactured using a bis(chlorophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined by DMA on a film sample,

at least 30% lower stiffness than the stiffness of the same polyetherimide manufactured using the bis(chlorophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide), each determined by DMA over 30° C. to 110° C., on a film sample, and

a ratio of low shear rate viscosity to high shear rate viscosity that is at least 30% higher than the same ratio of the same polyetherimide manufactured using the bis(chlorophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(chlorophthalimide) and more than 55 weight percent of the 4,4′-bis(chlorophthalimide), each determined by parallel plate rheometry.

24. The method of claim 22 , wherein

M is sodium,

Z is a divalent radical of the formula

wherein Q is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, —C y H 2y — wherein y is an integer from 1 to 5, and a halogenated derivative thereof; and

R is a divalent group of formula

wherein Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, or —C y H 2y — wherein y is an integer from 1 to 5.

25. The method of claim 24 , wherein Z is 2,2-(4-phenylene)isopropylidene and R is m-phenylene, p-phenylene, p-phenylene diarylsulfone, or a combination thereof.

26. An article comprising the composition of claim 1 .

27. The article of claim 26 , selected from a sheet, film, multilayer sheet, multilayer film, molded part, extruded profile, coated part, and fiber.

28. The article of claim 27 , wherein the article is a molded part having a thickness from 1 to 5 millimeters.

29. The article of claim 26 , selected from a reflector, an optical lens, a fiber optic connector, and an adhesive.

30. The article of claim 26 , the article comprising

(i) a polytetrafluoroethylene substrate having a first surface,

(ii) a metal substrate having a second surface, and

(iii) the polymer composition of claim 1 , situated between the polytetrafluoroethylene substrate and the metal substrate.

31. An article comprising the composition of claim 10 .

32. The article of claim 30 , selected from a sheet, film, multilayer sheet, multilayer film, molded part, extruded profile, coated part, and fiber.

33. The article of claim 30 , wherein the article is a molded part having a thickness from 1 to 5 millimeters.

34. The article of claim 30 , selected from a reflector, an optical lens, a fiber optic connector, and an adhesive.

35. The article of claim 30 , the article comprising

(i) a polytetrafluoroethylene substrate having a first surface,

(ii) a metal substrate having a second surface, and

(iii) the polymer composition of claim 1 , situated between the polytetrafluoroethylene substrate and the metal substrate.

36. A method of forming an article, comprising shaping, extruding, blow molding, or molding the composition of claim 1 to form an article.

37. The method of claim 36 , comprising molding the composition to form an article having a thickness from 1 to 5 millimeters.

38. A method of forming an article, comprising shaping, extruding, blow molding, or molding the composition of claim 10 to form an article.

39. The method of claim 38 , comprising molding the composition to form an article having a thickness from 1 to 5 millimeters.

40. A polyetherimide of the formula

wherein,

based on the total mole percent of the —O—Z—O— groups in the polyetherimide,

more than 45 to less than 75 mole percent the divalent bonds of the —O—Z—O— groups are in the 3,3′ position,

more than 0 to less than 10 mole percent of the —O—Z—O— groups are in the 3,4′, and 4′,3 positions, and

more than 45 to less than 75 mole percent of the —O—Z—O— groups are 4,4′ position;

n is greater than 1;

each R is independently an aromatic hydrocarbon group having 6 to 30 carbon atoms, a halogenated derivative thereof, a straight or branched chain alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 3 to 20 carbon atoms, or a divalent group of the formula

wherein Q 1 is selected from —O—, —S—, —C(O)—, —SO 2 —, —SO—, and —C y H 2y — wherein y is 1 to 5 and a halogenated derivative thereof; and

each Z is independently an aromatic C 6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C 1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, and

wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct, based on the total weight of the polyetherimide.

41. The polyetherimide of claim 40 , wherein R is a divalent group of formula

wherein Q 1 is —O—, —S—, —C(O)—, —SO 2 —, —SO—, or —C y H 2y — wherein y is an integer from 1 to 5.

42. The composition of claim 40 , wherein Z is 2,2-(4-phenylene)isopropylidene and R is m-phenylene, p-phenylene, p-phenylene diarylsulfone, or a combination thereof.

43. The composition of claim 40 , wherein the polyetherimide comprises less than 3000 parts per million of a halide, based on the total parts of the polyetherimide.

44. The composition of claim 40 , wherein

more than 45 to less than 55 mole percent the divalent bonds of the —O—Z—O— groups are in the 3,3′ position,

less than 10 mole percent of the —O—Z—O— groups are in the 3,4′, and 4′,3 positions, and

more than 45 to less than 55 mole percent of the —O—Z—O— groups are in the 4,4′ position.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 12/116841, 12/123274, 12/345155, 13/177651, 13/234682, 13/259855, 13/355684, 13/904372, 13/956615, 14/146802, 62/011336 PREVIOUSLY RECORDED ON REEL 033591 FRAME 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 29, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033663/0427 →
CORRECTIVE ASSIGNMENT TO CORRECT REMOVE 10 APPL. NUMBERS PREVIOUSLY RECORDED AT REEL: 033591 FRAME: 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 28, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033649/0529 →
CHANGE OF NAME Recorded Aug 22, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033591/0673 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2011
From: KUHLMAN, MATTHEW L.; HARALUR, GURULINGAMURTHY M.
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 027245/0575 →