IP Library Granted Patent US 8,808,859
Granted Patent B1
US 8,808,859 · App. 13/285,198 · Granted Aug 19, 2014

Polycrystalline diamond compact including pre-sintered polycrystalline diamond table having a thermally-stable region and applications therefor

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Quick Facts
Patent No.
US 8,808,859
App. No.
13/285,198
Granted
Aug 19, 2014
Kind
B1
Abstract

In an embodiment, a polycrystalline diamond compact (“PDC”) comprises a substrate and a pre-sintered polycrystalline diamond (“PCD”) table including a plurality of bonded diamond grains defining a plurality of interstitial regions, an upper surface, and a back surface that is bonded to the substrate. The pre-sintered PCD table includes a first thermally-stable region extending inwardly from the upper surface, and a second region located between the first thermally-stable region and the substrate. The second region exhibits a thermal stability that is less than that of the first thermally-stable region, and includes at least one interstitial constituent disposed interstitially between the bonded diamond grains thereof. The at least one interstitial constituent may include at least one silicon-containing phase.

Claims (30)

1. A polycrystalline diamond compact, comprising:

a substrate; and

a pre-sintered polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions and exhibiting diamond-to-diamond bonding therebetween, an upper surface, and a back surface that is bonded to the substrate, the pre-sintered polycrystalline diamond table including:

a first thermally-stable region extending inwardly from the upper surface; and

a second region located between the first thermally-stable region and the substrate, the second region exhibiting a thermal stability that is less than that of the first thermally-stable region, the second region including at least one interstitial constituent disposed interstitially between the bonded diamond grains thereof, the at least one interstitial constituent including at least one silicon-containing phase.

2. The polycrystalline diamond compact of claim 1 wherein the at least one silicon-containing phase comprises at least one member selected from the group consisting of silicon carbide, a mixed carbide of cobalt and silicon, silicon, and a silicon-cobalt alloy phase.

3. The polycrystalline diamond compact of claim 2 wherein the silicon-cobalt alloy phase comprises cobalt silicide.

4. The polycrystalline diamond compact of claim 1 wherein the at least one interstitial constituent comprises at least one cobalt-containing phase.

5. The polycrystalline diamond compact of claim 4 wherein the at least one cobalt-containing phase comprises at least one member selected from the group consisting of cobalt and cobalt carbide.

6. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is depleted of cobalt relative to the second region.

7. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is depleted of cobalt relative to the second region, and further wherein the first thermally-stable region includes at least one interstitial constituent disposed interstitially between the bonded diamond grains thereof, the at least one interstitial constituent of the first thermally-stable region selected from the group consisting of silicon carbide, cobalt carbide, a mixed carbide of cobalt and silicon, and cobalt silicide.

8. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is substantially free of cobalt that is not included in a chemical compound.

9. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is depleted of one or more types of oxides relative to the second region.

10. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is depleted of one or more types of oxides relative to the second region, and further wherein the first thermally-stable region includes silicon carbide disposed interstitially between the bonded diamond grains thereof and is substantially free of cobalt.

11. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table exhibits a wear resistance that is greater than that of the second region.

12. The polycrystalline diamond compact of claim 1 wherein the pre-sintered polycrystalline diamond table comprises a third region adjacent to the second region and bonded to the substrate, the third region including a metallic infiltrant infiltrated from the substrate that is interstitially disposed between the bonded diamond grains thereof.

13. The polycrystalline diamond compact of claim 1 wherein the pre-sintered polycrystalline diamond table comprises tungsten, tungsten carbide, or combinations thereof disposed interstitially between the bonded diamond grains thereof.

14. The polycrystalline diamond compact of claim 1 wherein the substrate comprises a cemented carbide.

15. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is structured to preferentially form a cutting lip during cutting operations over the second region of the pre-sintered polycrystalline diamond table.

16. The polycrystalline diamond compact of claim 1 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table has been chemically treated to enhance a thermal stability thereof compared to the thermally stability of the second region of the pre-sintered polycrystalline diamond table.

17. A polycrystalline diamond compact, comprising:

a cemented carbide substrate including a metallic infiltrant therein; and

a pre-sintered polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions and exhibiting diamond-to-diamond bonding therebetween, an upper surface, and a back surface that is bonded to the substrate, the pre-sintered polycrystalline diamond table including:

a first thermally-stable region extending inwardly from the upper surface;

wherein the first thermally-stable region is substantially free of cobalt that is not included in a chemical compound, depleted of one or more types of oxides relative to the second region, or combinations thereof; and

wherein the first thermally-stable region includes silicon carbide disposed interstitially between the bonded diamond grains thereof;

a second region located between the first thermally-stable region and the substrate, the second region exhibiting a thermal stability that is less than that of the first thermally-stable region, the second region including at least one interstitial constituent disposed interstitially between the bonded diamond grains thereof, the at least one interstitial constituent including at least one silicon-containing phase; and

a third region bonded to the substrate, the third region positioned relative to the first thermally-stable region and the second region so that the second region is located between the first thermally-stable region and the third region, the third region including a portion of the metallic infiltrant infiltrated from the substrate that is interstitially disposed between the bonded diamond grains thereof.

18. The polycrystalline diamond compact of claim 17 wherein the first thermally-stable region of the pre-sintered polycrystalline diamond table is structured to preferentially form a cutting lip during cutting operations over the second region of the pre-sintered polycrystalline diamond table.

19. The polycrystalline diamond compact of claim 17 wherein the at least one silicon-containing phase comprises at least one member selected from the group consisting of silicon carbide, a mixed carbide of cobalt and silicon, silicon, and a silicon-cobalt alloy phase.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →