IC manufacturing method, IC and apparatus
View Patent ↗A method of manufacturing an integrated circuit having a substrate comprising a plurality of components and a metallization stack over the components, the metallization stack comprising a first sensing element and a second sensing element adjacent to the first sensing element.
1. An integrated circuit comprising a substrate carrying a plurality of components and a metallization stack over said plurality of components, the metallization stack comprising a first sensing element and a second sensing element adjacent to the first sensing element, the integrated circuit further comprising a patterned moisture-impenetrable layer over the metallization stack and a patterned passivation layer over the moisture-impenetrable layer, said patterned passivation layer comprising:
a void exposing the first sensing element; and
a trench filled with a further moisture-impenetrable material to define a guard ring delimiting a region over the first or second sensing element, said guard ring extending through the passivation layer and the underlying moisture-impenetrable layer to a portion of the metallization stack.
2. The integrated circuit of claim 1 , wherein said further moisture-impenetrable material further covers the region over the second sensing element.
3. The integrated circuit of claim 1 , wherein the further moisture-impenetrable material comprises Al.
4. The integrated circuit of claim 1 , wherein the metallization stack comprises a plurality of patterned metal layers separated by respective dielectric layers, and wherein the second sensing element is located in a cavity formed by the partial removal of the dielectric layers.
5. The integrated circuit of claim 4 , wherein the second sensing element comprises:
first and second conductive support structures; and
an inertial mass element comprising at least one metal portion conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions.
6. The integrated circuit of claim 1 , wherein the first sensing element comprises a transducer.
7. The integrated circuit of claim 6 , wherein the first sensing element is a pH sensor or a gas sensor.
8. An article comprising the integrated circuit of claim 1 .