Headlamp assembly having a heat sink structure and wire heating element for removing water based contamination
View Patent ↗A headlamp assembly having a mechanism for reducing water based contamination is disclosed. A headlamp assembly includes a lens affixed to a housing having an inner surface and an outer surface, a wire heating element embedded within the inner surface of the lens, wherein the wire heating element is electrically coupled to a circuit board. An encapsulation layer is disposed over the wire heating element and a thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition. The thermistor is electrically coupled to the circuit board and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.
1. A headlamp assembly comprising:
a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;
a heat sink structure having a first surface and a second surface;
a main circuit board;
a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;
a lens affixed to the housing having an inner surface and an outer surface;
a wire heating element circuit board affixed to said lens;
a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;
an encapsulation layer disposed over of the wire heating element;
a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board; and
a micro-controller for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.
2. The headlamp assembly of claim 1 , wherein the wire heating element comprises a copper core and a silver coating.
3. The headlamp assembly of claim 1 , wherein said wire heating element is embedded in said lens at a depth of 2.3×10 −3 to 3.5×10 −3 inches.
4. The headlamp assembly of claim 1 , wherein said wire heating element circuit board is electrically connected to said main circuit board.
5. The headlamp assembly of claim 1 , wherein said wire heating element, wire heating element circuit board, and thermistor are embedded in said lens.
6. The headlamp assembly of claim 1 , wherein a distance from an outer surface of said thermistor to the outer surface of said lens is no more than one tenth of a distance between said outer surface of the thermistor and the inner surface of said lens, represented by an equation: Do≦( 1/10) Di, where Do=the distance from the thermistor to the outer surface of the lens and Di=the distance between the thermistor and inner lens.
7. The headlamp assembly of claim 1 , wherein a harness connects said wire heating element circuit board and thermistor to said main circuit board.
8. The headlamp of claim 7 , wherein pins connect said harness to said main circuit board.
9. The headlamp of claim 1 , wherein said housing functions as a heat sink.
10. A headlamp assembly comprising:
a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;
a heat sink structure having a first surface and a second surface;
a main circuit board;
a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;
a lens affixed to the housing having an inner surface and an outer surface;
a wire heating element circuit board affixed to said lens;
a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;
an encapsulation layer disposed over the wire heating element;
a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board; and
a harness electrically connecting said heating wire element circuit board to said main circuit board.
11. The headlamp of claim 10 , wherein said heat sink bisects said housing into upper and lower areas.
12. The headlamp of claim 10 , wherein said wire heating element is embedded in said lens at a depth of 2.3×10 −3 and 3.5×10 −3 inches.
13. The headlamp of claim 10 , wherein said wire heating element, wire heating element circuit board and thermistor are embedded in said lens.
14. The headlamp of claim 10 , wherein a distance from an outer surface of said thermistor to the outer surface of said lens is no more than one tenth of a distance between said outer surface of the thermistor and the inner surface of said lens, represented by an equation: Do≦( 1/10) Di, where Do=the distance from the thermistor to the outer surface of the lens and Di=the distance between the thermistor and inner lens.
15. The headlamp of claim 10 , wherein a plurality of spring loaded pins disposed on said harness connect leads of said wire heating element circuit board and thermistor to the main circuit board.
16. The headlamp of claim 10 , wherein said housing includes receiving features adapted to receive said harness.
17. The headlamp of claim 16 , wherein said receiving features comprise a flat seating plane, a plurality of tapered pins, and a guide channel.
18. The headlamp of claim 17 , wherein said harness includes an extrusion that fits into said guide channel.
19. The headlamp of claim 17 , wherein said harness comprises tapered holes that mate with said tapered pins.
20. A headlamp assembly comprising:
a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;
a heat sink structure having a first surface and a second surface;
a main circuit board;
a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;
a lens affixed to the housing having an inner surface and an outer surface;
a wire heating element circuit board affixed to said lens;
a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;
an encapsulation layer disposed over the wire heating element;
a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board;
a harness electrically connecting said heating wire element circuit board to said main circuit board; and
a micro-controller for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor;
wherein said wire heating element, wire heating element circuit board, and thermistor are embedded in said lens.