Methods and apparatus for thinning, testing and singulating a semiconductor wafer
View Patent ↗A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator acts as a mechanical support during a thinning process as well as during a wafer dicing operation. The singulated integrated circuits are then removed from the wafer translator. In some embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer thinning process but before the wafer and wafer translator are separated. In other embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer dicing operation but before the diced wafer and wafer translator are separated.
1. A method, comprising:
disposing a wafer translator having an inquiry-side and a wafer-side on a vacuum chuck such that the inquiry-side is facing the vacuum chuck;
disposing a wafer bonding releasable adhesive material on the wafer-side of the wafer translator;
patterning the wafer bonding releasable adhesive material such that a plurality of wafer-side contact structures are exposed to a wafer having a topside with a plurality of integrated circuits and a backside;
aligning the topside of the wafer with the wafer-side of the wafer translator;
bringing the wafer into electrical contact with the wafer-side contact structures through a pattern in the releasable adhesive material, and applying heat and pressure to removably attach the wafer and wafer translator, thereby forming a wafer/wafer translator pair in an attached state;
after forming the wafer/wafer translator pair capable of being tested, thinning the wafer from the wafer backside;
dicing the wafer to form one or more individual integrated circuits; and
removing one or more diced integrated circuits.
2. The method of claim 1 , wherein the wafer translator has a silicon core.
3. The method of claim 1 , further comprising performing wafer level testing subsequent to thinning the wafer and prior to dicing the wafer.
4. The method of claim 1 , further comprising performing die testing subsequent to thinning the wafer and subsequent to dicing the wafer.
5. The method of claim 1 , further comprising:
cooling the wafer/wafer translator pair in the attached state prior to thinning the wafer.
6. The method of claim 1 , further comprising:
cooling the wafer/wafer translator pair in the attached state prior to performing wafer level testing on the wafer.
7. The method of claim 1 , further comprising:
cooling the wafer/wafer translator pair in the attached state prior to dicing the wafer.
8. The method of claim 4 , wherein thinning is performed prior to dicing.
9. The method of claim 1 , wherein dicing is performed by wafer sawing.
10. The method of claim 1 , wherein applying heat and pressure does not bring the wafer bonding material to its set temperature.
11. A method, comprising:
disposing a wafer translator having an inquiry-side and a wafer-side on a vacuum chuck with the inquiry-side facing the vacuum chuck;
disposing a releasable adhesive material on the wafer-side of the wafer translator;
patterning the releasable adhesive material to expose a plurality of wafer-side contact structures carried by the wafer-side of the wafer translator;
positioning a first side of a wafer to face the wafer-side of the wafer translator, the first side of the wafer carrying a plurality of integrated circuits;
making electrical contact between the wafer-side contact structures and the wafer through openings in the releasable adhesive material to removably attach the wafer and wafer translator, thus forming a wafer/wafer translator pair;
after forming the wafer/wafer translator pair, thinning the wafer from a second side of the wafer, the second side facing away from the first side of the wafer; and
dicing the wafer to form one or more individual integrated circuits.