Lighting apparatus having improved light output uniformity and thermal dissipation

1. An apparatus, comprising:

a light-emitting package that includes a light-emitting device sealed inside a diffuser cap and a substrate; and

a reflective structure located outside the light-emitting package and thermal-conductively coupled to the light-emitting package, wherein the reflective structure surrounds the light-emitting package, is operable to reflect light radiated by the light-emitting package, and is operable to thermally dissipate heat generated by the light-emitting package;

wherein:

the light-emitting device is located over the substrate; and

a surface of the substrate over which the light-emitting device is located is operable to reflect light.

2. The apparatus of claim 1 , wherein the diffuser cap has a textured surface.

3. The apparatus of claim 1 , wherein the cap has a curved shape.

4. The apparatus of claim 1 , wherein the substrate includes a printed circuit board (PCB).

5. The apparatus of claim 1 , wherein the reflective structure circumferentially encircles the light-emitting package.

6. The apparatus of claim 1 , wherein the reflective structure includes a reflector cup having a sloped sidewall profile.

7. The apparatus of claim 1 , further comprising:

a thermal dissipation structure thermally coupled to the substrate.

8. The apparatus of claim 7 , wherein:

the thermal dissipation structure includes a board and a plurality of fins attached to the board; and

the substrate is located on the board.

9. The apparatus of claim 1 , wherein the light-emitting device includes one or more light-emitting diodes.

10. The apparatus of claim 1 , wherein the apparatus includes a down light lighting module, and wherein the light-emitting package, the reflective structure, and the thermal dissipation structure are integrated within the down light lighting module.

11. A lamp, comprising:

one or more light-emitting devices disposed on a thermally conductive board;

a non-flat diffuser cap disposed on the thermally conductive board, the diffuser cap housing the one or more light-emitting devices therein;

a thermally conductive reflector cup surrounding the diffuser cap and the one or more light-emitting devices, the reflector cup being operable to reflect a portion of light propagating through the diffuser cap, the reflector cup being thermally coupled to the thermally conductive board; and

a heat sink disposed below the thermally conductive board, the heat sink being thermally coupled to the thermally conductive board.

12. The lamp of claim 11 , wherein:

the light-emitting devices include light-emitting diodes; and

the thermally conductive board is a printed circuit board (PCB).

13. The lamp of claim 11 , wherein the diffuser cap includes a roughened surface.

14. The lamp of claim 11 , wherein the reflector cup is taller than the diffuser cap.

15. The lamp of claim 11 , wherein a surface of the thermally conductive board on which the one or more light-emitting devices are disposed is partially coated with a reflective material.

16. A lighting module, comprising:

a photonic device that generates light;

a thermally-conductive printed circuit board (PCB) on which the photonic device is located;

a diffuser cap having a curved profile covering the PCB and the photonic device, the diffuser cap having a textured surface for scattering light generated by the photonic device;

a thermally conductive cup surrounding the diffuser cap and thermal-conductively coupled to the PCB, the cup having a reflective inner surface that reflects at least a portion of light transmitting through the diffuser cap; and

a heat dissipation structure thermally coupled to the cup.

17. The lighting module of claim 16 , wherein the cup has greater dimensions in both a horizontal direction and a vertical direction than the diffuser cap.

18. The lighting module of claim 16 , wherein the photonic device includes one or more light-emitting diodes.

19. The lighting module of claim 16 , wherein the heat dissipation structure is thermally coupled to the cup through the PCB.

20. The lighting module of claim 16 , wherein the thermally conductive cup has a sloped side view profile.