Semiconductor device
View Patent ↗A semiconductor device includes a first, second, and third MIS transistors of a first conductivity type respectively including a first, second, and third gate electrodes on a first, second, and third active regions of a semiconductor substrate with a first, second, and third gate insulating films interposed therebetween. The first gate insulating film is formed of a first silicon oxide film and a first high-k insulating film on the first silicon oxide film. The second gate insulating film is formed of a second silicon oxide film and a second high-k insulating film on the second silicon oxide film. The third gate insulating film is formed of a third silicon oxide film and a third high-k insulating film on the third silicon oxide film. The second silicon oxide film has a same thickness as the first silicon oxide film, and a greater thickness than the third silicon oxide film.
1. A semiconductor device comprising:
a first MIS transistor of a first conductivity type including a first gate electrode formed on a first active region of a semiconductor substrate with a first gate insulating film interposed therebetween;
a second MIS transistor of the first conductivity type including a second gate electrode which is formed on a second active region of the semiconductor substrate with a second gate insulating film interposed therebetween, and has a shorter gate length than the first gate electrode;
a third MIS transistor of the first conductivity type including a third gate electrode which is formed on a third active region of the semiconductor substrate with a third gate insulating film interposed therebetween, and has a shorter gate length than the second gate electrode,
a first extension region of the first conductivity type formed in the first active region below a side of the first gate electrode;
a second extension region of the first conductivity type formed in the second active region below a side of the second gate electrode; and
a third extension region of the first conductivity type formed in the third active region below a side of the third gate electrode, wherein
the first gate insulating film is formed of a first silicon oxide film and a first high-k insulating film provided on the first silicon oxide film,
the second gate insulating film is formed of a second silicon oxide film and a second high-k insulating film provided on the second silicon oxide film,
the third gate insulating film is formed of a third silicon oxide film and a third high-k insulating film provided on the third silicon oxide film,
the second silicon oxide film has a substantially same thickness as the first silicon oxide film and a greater thickness than the third silicon oxide film, and
the second extension region has an impurity concentration substantially equal to or higher than an impurity concentration of the first extension region, and lower than an impurity concentration of the third extension region.
2. The semiconductor device of claim 1 , further comprising:
a first channel diffusion layer of a second conductivity type formed in the first active region under the first gate insulating film;
a second channel diffusion layer of the second conductivity type formed in the second active region under the second gate insulating film; and
a third channel diffusion layer of the second conductivity type formed in the third active region under the third gate insulating film, wherein
the second channel diffusion layer has an impurity concentration higher than an impurity concentration of the first channel diffusion layer, and lower than an impurity concentration of the third channel diffusion layer.
3. The semiconductor device of claim 1 , wherein the second MIS transistor has an operating voltage lower than an operating voltage of the first MIS transistor, and higher than an operating voltage of the third MIS transistor.
4. The semiconductor device of claim 1 , wherein the first high-k insulating film, the second high-k insulating film, and the third high-k insulating film have a substantially same thickness.
5. The semiconductor device of claim 1 , wherein
the first gate electrode is formed of a first metal film and a first silicon film provided on the first metal film,
the second gate electrode is formed of a second metal film and a second silicon film provided on the second metal film, and
the third gate electrode is formed of a third metal film and a third silicon film provided on the third metal film.
6. The semiconductor device of claim 1 , wherein the first high-k insulating film, the second high-k insulating film, and the third high-k insulating film are made of a metal oxide having a relative dielectric constant of 10 or more.
7. The semiconductor device of claim 1 , wherein
each of the first silicon oxide film and the second silicon oxide film has a thickness ranging from 3 nm to 6 nm, and
the third silicon oxide film has a thickness ranging from 0.8 nm to 1.2 nm.
8. The semiconductor device of claim 1 , wherein the first high-k insulating film, the second high-k insulating film, the third high-k insulating film are made of a same material.
9. The semiconductor device of claim 5 , wherein the first metal film, the second metal film, and the third metal film have a substantially same thickness.
10. The semiconductor device of claim 5 , wherein the first metal film, the second metal film, and the third metal film are made of a same material.
11. The semiconductor device of claim 5 , wherein the first silicon film, the second silicon film, and the third silicon film have a substantially same thickness.
12. The semiconductor device of claim 5 , wherein the first silicon film, the second silicon film, and the third silicon film are made of a same material.
13. The semiconductor device of claim 1 , wherein the second extension region has a depth shallower than a depth of the first extension region, and greater than a depth of the third extension region.