FORMING MICROSTRUCTURES AND ANTENNAS FOR TRANSPONDERS
Microstructures such as connection areas, contact pads, antennas, coils, plates for capacitors and the like may be formed using nanostructures such as nanoparticles, nanowires and nanotubes. A laser may be used to assist in the process of microstructure formation, and may also be used to form other features on a substrate such as recesses or channels for receiving the microstructures. A smart mobile phone sticker (MPS) mounted to a cell phone with a self-sticking shielding element comprising a core layer having ferrite particles.
1 . A method of forming microstructures and antennas for RFID transponders comprising:
coating a surface of a substrate with nanostructures; and
modifying a portion of the medium to form a conductive track.
2 . The method of claim 1 , further comprising:
forming at least one channel in a surface of the substrate.
3 . The method of claim 2 , further comprising:
depositing nanostructures while forming the channel.
4 . The method of claim 1 , wherein:
the at least one channel is formed by laser ablation.
5 . The method of claim 1 , wherein:
the substrate comprises a polymer.
6 . The method of claim 1 , wherein:
the substrate is an inlay substrate for a secure document.
7 . The method of claim 1 , further comprising:
the nanostructures are from the group consisting of nanoparticles, nanowires and nanotubes.
8 . A method of connecting an antenna wire to a chip or chip module on a transponder substrate comprising:
designating two portions of the substrate as enlarged connection portions;
forming channels in each of the enlarged connection portions for receiving end portions of the antenna wire;
coating the connection portions including the channels with conductive nanoparticles; and
laying the end portions of the antenna wire in the channels.
9 . The method of claim 8 , further comprising:
disposing the chip or chip module onto the substrate with its terminals facing down, each terminal area received by a respective one of the enlarged connection portions.
10 . The method of claim 8 , further comprising:
prior to coating the connection portions, forming depressions in each of the enlarged connection portions of the substrate for receiving a respective one of the terminals of the chip or chip module.
11 . A method of mounting an RFID tag to a cell phone comprising:
disposing a shielding element between the RFID tag and the cell phone.
12 . The method of claim 11 , wherein the shielding element comprises:
a core layer having two surfaces and having ferrite particles; and
adhesive layers on the two surfaces of the core layer.
13 . The method of claim 11 , wherein the shielding element further comprises:
a release layer.
14 . The method of claim 11 , wherein:
the core layer is in the form of an elongate tape.
15 . The method of claim 14 , wherein:
the tape is supplied in roll form.
16 . The method of claim 11 , wherein:
the RFID tag comprises a smart mobile phone sticker (MPS).