Electronic component

1. An electronic component comprising:

a substrate;

a thin-film element layer provided on the substrate;

first and second bump electrodes provided on a surface of the thin-film element layer; and

an insulator layer provided on the surface of the thin-film element layer and filling a first space between the first bump electrode and the second bump electrode, wherein

the thin-film element layer contains a first spiral conductor, which is a plane coil pattern,

the first bump electrode is connected to an internal peripheral end of the first spiral conductor,

the second bump electrode is connected to an external peripheral end of the first spiral conductor,

each of the first and second bump electrodes has a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer,

the first exposure surface of the first bump electrode and the first exposure surface of the second bump electrode have different shapes and sizes, and

each second exposure surface of the first and second bump electrodes is provided above the thin-film element layer,

the electronic component further comprising third and fourth bump electrodes provided on the surface of the thin-film element layer, wherein

the thin-film element layer further contains a second spiral conductor magnetically coupled to the first spiral conductor and composed of a plane coil pattern,

the insulator layer fills a second space between the first to fourth bump electrodes,

the third bump electrode is connected to an internal peripheral end of the second spiral conductor,

the fourth bump electrode is connected to an external peripheral end of the second spiral conductor,

each of the third and fourth bump electrodes has a first exposure surface exposed to the principal surface of the insulator layer and a second exposure surface exposed to the end face of the insulator layer,

the first exposure surface of the third bump electrode and the first exposure surface of the fourth bump electrode have mutually different shapes and sizes, and

each second exposure surface of the third and fourth bump electrodes is provided above the thin-film element layer.

2. The electronic component as claimed in claim 1 , wherein the first exposure surface of the first bump electrode and the first exposure surface of the third bump electrode have the same shape and size and

the first exposure surface of the second bump electrode and the first exposure surface of the fourth bump electrode have the same shape and size.

3. An electronic component comprising:

a substrate;

a thin-film element layer provided on the substrate;

first to fourth bump electrodes provided on a surface of the thin-film element layer; and

an insulator layer provided on the surface of the thin-film element layer and filling a space between the first to fourth bump electrodes, wherein

the thin-film element layer contains first and second spiral conductors that are magnetically coupled to each other and composed of plane coil patterns,

the first bump electrode is connected to an internal peripheral end of the first spiral conductor,

the second bump electrode is connected to an external peripheral end of the first spiral conductor,

the third bump electrode is connected to an internal peripheral end of the second spiral conductor,

the fourth bump electrode is connected to an external peripheral end of the second spiral conductor,

each of the first to fourth bump electrodes has a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer,

the first exposure surface of the first bump electrode and the first exposure surface of the second bump electrode have different shapes and sizes, and

the first exposure surface of the third bump electrode and the first exposure surface of the fourth bump electrode have mutually different shapes and sizes.

4. The electronic component as claimed in claim 3 , wherein

an area of the first exposure surface of the first bump electrode is larger than that of the second bump electrode, and

an area of the first exposure surface of the third bump electrode is larger than that of the fourth bump electrode.

5. The electronic component as claimed in claim 4 , wherein

the thin-film element layer further contains an insulating layer covering the first spiral conductor, a first contact hole conductor electrically connecting the internal peripheral end of the first spiral conductor and the first bump electrode by passing through the insulating layer, and a second contact hole conductor electrically connecting the internal peripheral end of the second spiral conductor and the third bump electrode by passing through the insulating layer,

the first bump electrode is provided so as to cover the first contact hole conductor on the insulating layer, and

the third bump electrode is provided so as to cover the second contact hole conductor on the insulating layer.

6. The electronic component as claimed in claim 4 , further comprising:

a first lead conductor provided on the surface of the thin-film element layer together with the first to fourth bump electrodes and formed integrally with the first bump electrode; and

a second lead conductor provided on the surface of the thin-film element layer together with the first to fourth bump electrodes and formed integrally with the third bump electrode, wherein

the thin-film element layer further contains:

an insulating layer covering the first spiral conductor;

a first contact hole conductor electrically connecting the internal peripheral end of the first spiral conductor and an end of the first lead conductor by passing through the insulating layer; and

a second contact hole conductor electrically connecting the internal peripheral end of the second spiral conductor and an end of the second lead conductor by passing through the insulating layer,

the first bump electrode is connected to the first contact hole conductor via the first lead conductor, and

the third bump electrode is connected to the second contact hole conductor via the second lead conductor.

7. The electronic component as claimed in claim 3 , wherein

the first exposure surface of the first bump electrode and the first exposure surface of the third bump electrode have the same shape and size, and

the first exposure surface of the second bump electrode and the first exposure surface of the fourth bump electrode have the same shape and size.

8. An electronic component comprising:

a substrate;

a thin-film element layer provided on the substrate;

first and second bump electrodes provided on a surface of the thin-film element layer; and

an insulator layer provided on the surface of the thin-film element layer and filling a first space between the first bump electrode and the second bump electrode, wherein

the thin-film element layer contains a first spiral conductor, which is a plane coil pattern,

the first bump electrode is connected to an internal peripheral end of the first spiral conductor,

the second bump electrode is connected to an external peripheral end of the first spiral conductor,

both of the first and second bump electrodes have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer,

the first exposure surface of the first bump electrode and the first exposure surface of the second bump electrode have different shapes and sizes, and

a thickness of each of the first and second bump electrodes is five-times or more than that of the first spiral conductor,

the electronic component further comprising third and fourth bump electrodes provided on the surface of the thin-film element layer, wherein

the thin-film element layer further contains a second spiral conductor magnetically coupled to the first spiral conductor and composed of a plane coil pattern,

the insulator layer fills a second space between the first to fourth bump electrodes,

the third bump electrode is connected to an internal peripheral end of the second spiral conductor,

the fourth bump electrode is connected to an external peripheral end of the second spiral conductor,

both of the third and fourth bump electrodes have a first exposure surface exposed to the principal surface of the insulator layer and a second exposure surface exposed to the end face of the insulator layer,

the first exposure surface of the third bump electrode and the first exposure surface of the fourth bump electrode have mutually different shapes and sizes, and

a thickness of each of the first to fourth bump electrodes is five-times or more than that of the first and second spiral conductor.

9. The electronic component as claimed in claim 8 , wherein an area of the first exposure surface of the first bump electrode is larger than that of the second bump electrode.

10. The electronic component as claimed in claim 8 , wherein the thin-film element layer further contains an insulating layer covering the first spiral conductor, and a first contact hole conductor electrically connecting the internal peripheral end of the first spiral conductor and

the first bump electrode by passing through the insulating layer, and

wherein the first bump electrode is provided so as to cover the first contact hole conductor on the insulating layer.

11. The electronic component as claimed in claim 8 further comprising a first lead conductor provided on the surface of the thin-film element layer together with the first and second bump electrodes and formed integrally with the first bump electrode, wherein

the thin-film element layer further contains an insulating layer covering the first spiral conductor, and a first contact hole conductor electrically connecting the internal peripheral end of the first spiral conductor and an end of the first lead conductor by passing through the insulating layer, and

wherein the first bump electrode is connected to the first contact hole conductor via the first lead conductor.

12. The electronic component as claimed in claim 8 , wherein

the first exposure surface of the first bump electrode and the first exposure surface of the third bump electrode have the same shape and size, and

the first exposure surface of the second bump electrode and the first exposure surface of the fourth bump electrode have the same shape and size.