Crystalline semiconductor film manufacturing method and crystalline semiconductor film manufacturing apparatus
View Patent ↗A semiconductor film manufacturing method includes: forming a metal layer above the substrate; forming a gate electrode in each of pixels by patterning a metal layer; forming a gate insulating firm on the gate electrode; forming an amorphous semiconductor film on the gate insulating film; and crystallizing the amorphous semiconductor film by irradiating the amorphous semiconductor film with a laser beam, and a laser irradiation width of the laser beam corresponds to n times a width of each pixel (n is an integer of 2 or above), a laser energy intensity is higher in one end portion of the laser irradiation width than in the other end portion, and in the crystallizing, the laser energy intensity of the laser beam is inverted in increments of n pixels, alternately between one of the end portions of the laser irradiation width of the laser beam and the other end portion.
1. A crystalline semiconductor film manufacturing method comprising:
forming a metal layer above a substrate;
forming a plurality of gate electrodes by patterning the metal layer such that each of pixels arranged in a matrix includes at least one of the gate electrodes;
forming a gate insulating film on the gate electrodes;
forming an amorphous semiconductor film on the gate insulating film; and
forming a crystalline semiconductor film by irradiating or by scanning the amorphous semiconductor film with a predetermined laser beam, so as to crystallize the amorphous semiconductor film,
wherein a laser irradiation width that is a width of the predetermined laser beam for the scanning corresponds to n times a width of the pixel where n is an integer equal to or above 2,
a laser energy intensity is higher in one end portion of the laser irradiation width than in the other end portion of the laser irradiation width, and
in the forming of a crystalline semiconductor film, the laser energy intensity of the predetermined laser beam is inverted in increments of n pixels, alternately between the one end portion and the other end portion of the laser irradiation width.
2. The crystalline semiconductor film manufacturing method according to claim 1 ,
wherein in the forming of a crystalline semiconductor film, when performing laser irradiation on the amorphous semiconductor film, the amorphous semiconductor film is irradiated with the predetermined laser beam at a constant scanning speed in a region in which the amorphous semiconductor is formed.
3. A crystalline semiconductor film manufacturing method comprising:
forming a metal layer above a substrate;
forming a plurality of gate electrodes by patterning the metal layer such that each of pixels arranged in a matrix includes at least one of the gate electrodes;
forming a gate insulating film on the gate electrodes;
forming an amorphous semiconductor film on the gate insulating film; and
forming a crystalline semiconductor film by irradiating or by scanning the amorphous semiconductor film with a predetermined laser beam, so as to crystallize the amorphous semiconductor film,
wherein a laser irradiation width that is a width of the predetermined laser beam for the scanning corresponds to n times a width of the pixel where n is an integer equal to or above 2,
a laser energy intensity is higher in one end portion of the laser irradiation width than in the other end portion of the laser irradiation width,
the pixel includes the at least one of the gate electrodes at a position closer to one end portion of the pixel from a virtual pixel center line of the pixel, the virtual center line running along a scanning direction of the predetermined laser beam,
the pixel includes the at least one of the gate electrodes, for each laser irradiation width of the predetermined laser beam, at a position closer to the other end portion of the pixel, and
in the forming of a crystalline semiconductor film, the laser energy intensity of the predetermined laser beam is inverted in increments of n pixels, alternately between the one end portion and the other end portion of the laser irradiation width.