GaAs Wafer And Method For Manufacturing The GaAs Wafer
There is provided a method for manufacturing a GaAs wafer comprising: growing a GaAs single crystal by an LEC method; and fabricating a GaAs wafer by slicing the GaAs single crystal obtained by growing the GaAs single crystal, wherein in growing the GaAs single crystal, a crystal-melt interface between the GaAs single crystal and a raw material melt is formed into a convex-shape toward the raw material melt side, and a ratio T 1/ T 2 of a length T 1 from an interface between the raw material melt and a liquid encapsulant to a tip of the GaAs single crystal, and an outer diameter T 2 of the GaAs single crystal, is in a range of 0.25≦T 1/ T 2 ≦0.45, and the GaAs wafer obtained by fabricating the GaAs wafer has a universal hardness of 4000 N/mm 2 or more and 4850 N/mm 2 or less uniformly in a wafer surface.
1 . A GaAs wafer, wherein universal hardness is 4000 N/mm 2 or more and 4850 N/mm 2 or less uniformly in a wafer surface.
2 . The GaAs wafer according to claim 1 , wherein the GaAs wafer is formed by an LEC method, and an outer diameter of the GaAs wafer is 100 mm or more.
3 . The GaAs wafer according to claim 1 , wherein a surface orientation of the GaAs wafer is the (100) plane, a plane equivalent to the (100) plane, the (110) plane, a plane equivalent to the (110) plane, the (111) plane, or a plane equivalent to the (111) plane.
4 . A method for manufacturing a GaAs wafer, comprising:
heating a crucible with a raw material and an encapsulant stored therein, and making a seed crystal brought into contact with a raw material melt covered with a liquid encapsulant in the crucible, and thereafter gradually pulling-up the seed crystal, and growing a GaAs single crystal so as to have a constant outer diameter; and
fabricating a GaAs wafer by slicing the GaAs single crystal obtained by growing the GaAs single crystal,
wherein in growing the GaAs single crystal, a crystal-melt interface between the GaAS single crystal and the raw material melt is formed into a convex-shape toward the raw material melt side, and a ratio T 1 /T 2 , being the ratio of a length T 1 from an interface between the raw material melt and the liquid encapsulant to a tip of the GaAs single crystal in the raw material melt, and the outer diameter T 2 of the GaAs single crystal, is in a range of 0.25≦T 1 /T 2 ≦0.45, and the GaAs wafer obtained by fabricating the GaAs wafer has a universal hardness of 4000 N/mm 2 or more and 4850 N/mm 2 or less uniformly in a wafer surface.