Implantable medical device and method of molding
View Patent ↗An implantable medical device that includes a first molded portion and a second molded portion fusion bonded to the first molded portion at an interface. The molded portions each are based on a moldable plastic material. A component, e.g., an electrical component, for the implantable device has at least one section disposed at the fusion-bonded interface of the first molded portion and the second molded portion so that the electronic component is fusion bonded to one or both portions at the interface.
1. A method of making an implantable medical device, the method comprising:
providing at least a portion of a first mold cavity configured to form at least a first molded construct of an implantable medical device, the mold cavity having a receiving feature configured to hold or to receive a component during an overmolding process;
introducing into the first mold cavity a moldable plastic material capable of taking the shape of the mold cavity, thereby forming a first molded construct of the device to a corresponding shape of the respective portion of the first mold cavity;
positioning a component in the respective portion of the first mold cavity before the introduction of moldable plastic material, or on the first molded construct following introduction of the moldable plastic material, so that at least one segment of the component is securely disposed at a surface of the formed first molded construct;
providing at least a portion of a second mold cavity configured to form at least a portion of an implantable medical device;
placing the formed first molded construct with the positioned component into the respective portion of the second mold cavity; and
introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity, thereby forming a second molded construct of the device to a corresponding shape of the second mold cavity, the first and second molded constructs being moldably fused together at an interface therebetween, wherein the component is disposed at the interface of the first molded construct and the second molded construct, wherein at least a portion of the component is disposed in an elongate path along the interface and wherein the second molded construct overlies the first construct and the portion of the component disposed along the elongate path so as to surround that portion of the component and to hermetically seal it.
2. A method according to claim 1 , wherein the portion of the component comprises a first portion of the component disposed in a channel formed in the first molded construct and a second portion extending outwardly of the channel, wherein the second molded construct overlies the second portion of the component extending outwardly of the channel.
3. A method according to claim 1 , wherein the component comprises at least one antenna or a conductor element that is exposed at a surface of the implantable medical device, free of material of the first construct and the second construct.
4. A method according to claim 1 , wherein the component comprises a first antenna or a first conductor element disposed along the elongate path, the method further comprising providing a second antenna or a second conductor element that is exposed at a surface of the device, free of material of the first construct and second construct.
5. A method according to claim 1 , wherein at least a region of the first molded construct is fusion-bonded to a corresponding region of the second molded construct.
6. A method according to claim 1 wherein the component is securely positioned adjacent a surface of the first molded construct after the forming of the first molded construct and before the formation of the second molded construct.
7. A method according to claim 1 , wherein:
the first molded construct defines one or more peripherally-positioned receptacle features configured to support a corresponding component, wherein a surface area of the first molded construct is less than about 60% of a projected plan area of the first molded construct; and
the act of positioning the component in the respective portion of the mold cavity comprises positioning the component to extend longitudinally of one of the receptacle features.
8. A method according to claim 7 , wherein the surface area of the first molded construct is less than about 30% of the projected plan area of the first molded construct.
9. A method according to claim 7 , wherein the component comprises an elongate component and the first molded construct comprises a skeletal frame configured to retain the elongate component during the act of introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity.
10. A method according to claim 9 , wherein the skeletal frame defines at least one cantilevered member configured to retain a corresponding portion of the elongate component.
11. A method according to claim 10 , wherein the second mold cavity comprises a corresponding support element of a molding die, and wherein the act of placing the first molded construct into the respective portion of the second mold cavity comprises engaging the support element of the molding die with a portion of the cantilevered member.
12. The implantable medical device of claim 11 , wherein the portion of the cantilevered member comprises a boss defining an aperture extending through the boss, wherein the act of engaging the support element of the molding die comprises extending a portion of the molding die through the boss and thereby supporting the cantilevered member of the skeletal frame.
13. A method according to claim 1 , wherein at least a portion of the component is disposed in an elongate path along the interface.
14. A method according to claim 13 , wherein the portion of the component comprises a first portion of the component disposed in a channel formed in the first molded construct and a second portion extending outwardly of the channel, wherein the second molded construct overlies the second portion of the component extending outwardly of the channel.
15. A method according to claim 13 , wherein the second molded construct overlies the first construct and the portion of the component disposed along the elongate path so as to surround that portion of the component and to hermetically seal it.
16. A method according to claim 15 , wherein the component comprises a first antenna or a first conductor element disposed along the elongate path, the method further comprising providing a second antenna or a second conductor element that is exposed at a surface of the device, free of material of the first construct and second construct.
17. A method of making an implantable medical device, the method comprising:
providing at least a portion of a first mold cavity configured to form at least a first molded construct of an implantable medical device, the mold cavity having a receiving feature configured to hold or to receive a component during an overmolding process;
introducing into the first mold cavity a moldable plastic material capable of taking the shape of the mold cavity, thereby forming a first molded construct of the device to a corresponding shape of the respective portion of the first mold cavity;
positioning a component in the respective portion of the first mold cavity before the introduction of moldable plastic material, or on the first molded construct following introduction of the moldable plastic material, so that at least one segment of the component is securely disposed at a surface of the formed first molded construct;
providing at least a portion of a second mold cavity configured to form at least a portion of an implantable medical device;
placing the formed first molded construct with the positioned component into the respective portion of the second mold cavity; and
introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity, thereby forming a second molded construct of the device to a corresponding shape of the second mold cavity, the first and second molded constructs being moldably fused together at an interface therebetween, wherein the component is disposed at the interface of the first molded construct and the second molded construct, wherein the component comprises at least one antenna or a conductor element that is exposed at a surface of the implantable medical device, free of material of the first construct and the second construct.
18. A method according to claim 17 , wherein at least a portion of the component is disposed in an elongate path along the interface.
19. A method according to claim 18 , wherein the portion of the component comprises a first portion of the component disposed in a channel formed in the first molded construct and a second portion extending outwardly of the channel, wherein the second molded construct overlies the second portion of the component extending outwardly of the channel.
20. A method according to claim 18 , wherein the second molded construct overlies the first construct and the portion of the component disposed along the elongate path so as to surround that portion of the component and to hermetically seal it.
21. A method according to claim 20 , wherein the component comprises a first antenna or a first conductor element disposed along the elongate path, the method further comprising providing a second antenna or a second conductor element that is exposed at a surface of the device, free of material of the first construct and second construct.
22. A method according to claim 17 , wherein at least a region of the first molded construct is fusion-bonded to a corresponding region of the second molded construct.
23. A method according to claim 17 wherein the component is securely positioned adjacent a surface of the first molded construct after the forming of the first molded construct and before the formation of the second molded construct.
24. A method according to claim 17 , wherein:
the first molded construct defines one or more peripherally-positioned receptacle features configured to support a corresponding component, wherein a surface area of the first molded construct is less than about 60% of a projected plan area of the first molded construct; and
the act of positioning the component in the respective portion of the mold cavity comprises positioning the component to extend longitudinally of one of the receptacle features.
25. A method according to claim 24 , wherein the surface area of the first molded construct is less than about 30% of the projected plan area of the first molded construct.
26. A method according to claim 24 , wherein the component comprises an elongate component and the first molded construct comprises a skeletal frame configured to retain the elongate component during the act of introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity.
27. A method according to claim 26 , wherein the skeletal frame defines at least one cantilevered member configured to retain a corresponding portion of the elongate component.
28. A method according to claim 27 , wherein the second mold cavity comprises a corresponding support element of a molding die, and wherein the act of placing the first molded construct into the respective portion of the second mold cavity comprises engaging the support element of the molding die with a portion of the cantilevered member.
29. The implantable medical device of claim 28 , wherein the portion of the cantilevered member comprises a boss defining an aperture extending through the boss, wherein the act of engaging the support element of the molding die comprises extending a portion of the molding die through the boss and thereby supporting the cantilevered member of the skeletal frame.
30. A method of making an implantable medical device, the method comprising:
providing at least a portion of a first mold cavity configured to form at least a first molded construct of an implantable medical device, the mold cavity having a receiving feature configured to hold or to receive a component during an overmolding process;
introducing into the first mold cavity a moldable plastic material capable of taking the shape of the mold cavity, thereby forming a first molded construct of the device to a corresponding shape of the respective portion of the first mold cavity;
positioning a component in the respective portion of the first mold cavity before the introduction of moldable plastic material, or on the first molded construct following introduction of the moldable plastic material, so that at least one segment of the component is securely disposed at a surface of the formed first molded construct;
providing at least a portion of a second mold cavity configured to form at least a portion of an implantable medical device;
placing the formed first molded construct with the positioned component into the respective portion of the second mold cavity; and
introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity, thereby forming a second molded construct of the device to a corresponding shape of the second mold cavity, the first and second molded constructs being moldably fused together at an interface therebetween, wherein the component is disposed at the interface of the first molded construct and the second molded construct, wherein the first molded construct defines one or more peripherally-positioned receptacle features configured to support a corresponding component, a surface area of the first molded construct is less than about 60% of a projected plan area of the first molded construct, and the act of positioning the component in the respective portion of the mold cavity comprises positioning the component to extend longitudinally of one of the receptacle features.
31. A method according to claim 30 , wherein the component comprises at least one antenna or a conductor element that is exposed at a surface of the implantable medical device, free of material of the first construct and the second construct.
32. A method according to claim 30 , wherein at least a region of the first molded construct is fusion-bonded to a corresponding region of the second molded construct.
33. A method according to claim 30 wherein the component is securely positioned adjacent a surface of the first molded construct after the forming of the first molded construct and before the formation of the second molded construct.
34. A method according to claim 30 , wherein the surface area of the first molded construct is less than about 30% of the projected plan area of the first molded construct.
35. A method according to claim 30 , wherein the component comprises an elongate component and the first molded construct comprises a skeletal frame configured to retain the elongate component during the act of introducing into the second mold cavity a moldable plastic material capable of taking the shape of the second mold cavity.
36. A method according to claim 35 , wherein the skeletal frame defines at least one cantilevered member configured to retain a corresponding portion of the elongate component.
37. A method according to claim 36 , wherein the second mold cavity comprises a corresponding support element of a molding die, and wherein the act of placing the first molded construct into the respective portion of the second mold cavity comprises engaging the support element of the molding die with a portion of the cantilevered member.
38. The implantable medical device of claim 37 , wherein the portion of the cantilevered member comprises a boss defining an aperture extending through the boss, wherein the act of engaging the support element of the molding die comprises extending a portion of the molding die through the boss and thereby supporting the cantilevered member of the skeletal frame.