HEAT-DISSIPATING DEVICE AND METHOD FOR FABRICATING THE SAME

1 . A heat-dissipating device, comprising:

a plurality of fin plates, arranged in contiguous manner, each of the fin plates including:

at least one fixing tab protruded from a top edge thereof; and

a supporting portion arranged adjacent to the at least one fixing tab;

wherein an accommodating space is defined between the supporting portions and the fixing tabs;

a heat pipe having a part disposed in the accommodating space; and

a cover board formed with a plurality of slits corresponding to the fixing tabs, wherein the fixing tabs pass through the slits and is fixed with the cover board.

2 . The heat-dissipating device of claim 1 , wherein the supporting portion of the fin plates are bent partially from a top edge thereof toward one side.

3 . The heat-dissipating device of claim 1 , wherein each of the fin plates further includes a first connecting plate and a second connecting plate, wherein the first connecting plate is located at an outer side of the fixing tab and is bent from a top edge of the fin plate toward one side, wherein the second connecting plate is bent from a bottom edge of the fin plate toward one side.

4 . The heat-dissipating device of claim 1 , wherein each of the fixing tabs has a top end bent toward one side and press against a top surface of the cover board.

5 . The heat-dissipating device of claim 1 , wherein the cover board further includes an extending portion extended toward one side, and a heat-dissipating fan is fixed on the extending portion adjacent the fin plates.

6 . The heat-dissipating device of claim 1 , further comprising at least one elastic leaf disposed on a bottom surface of the cover board and elastically against a top surface of the heat pipe.

7 . The heat-dissipating device of claim 1 , further comprising at least one thermal-insulating pad disposed between the cover board and the heat pipe.

8 . The heat-dissipating device of claim 1 , wherein the cover board is a metal board or a plastic board.

9 . A method for fabricating a heat-dissipating device, comprising steps as followed:

providing a plurality of fin plates, and forming at least one fixing tab on a top edge of each fin plate;

forming a supporting portion between the fixing tabs, and defining an accommodating space between the supporting portion and the fixing tabs;

providing a heat pipe, and disposing one part of the heat pipe in the accommodating space;

providing a cover board, and forming a plurality of slits on the cover board corresponding to the fixing tabs; and

passing the fixing tabs through the slits and fixing to the cover board.

10 . The method for fabricating a heat-dissipating device of claim 9 , wherein the step of fixing the cover board further comprises a step of bending a top end of the fixing tab to press against a top surface of the cover board.

11 . The method for fabricating a heat-dissipating device of claim 10 , further comprising a step of providing a shaping tool to bend the top end of the fixing tab.

12 . The method for fabricating a heat-dissipating device of claim 11 , wherein the shaping tool has a plurality of pressing weights protruded from a bottom surface thereof to press the fixing tab.

13 . The method for fabricating a heat-dissipating device of claim 12 , wherein the pressing weights are shaped in sawtooth, and each of the pressing weights has an oblique surface.

14 . The method for fabricating a heat-dissipating device of claim 11 , wherein the step of bending the top end of the fixing tab includes a step of moving the shaping tool along the top surface of the cover board.

15 . The method for fabricating a heat-dissipating device of claim 11 , further comprising a step of moving the shaping tool downward to flat the top ends against the cover board.

16 . The method for fabricating a heat-dissipating device of claim 11 , wherein the fin plates of odd numbers have one fixing tab at left side, and the fin plats of even numbers have one fixing tab at right side.