IP Library Granted Patent US 8,986,073
Granted Patent B2
US 8,986,073 · App. 13/298,915 · Granted Mar 24, 2015

Methods and apparatus for preparing power transmission cables

Inventors: Ladislaus Kehl (Dorfen, DE); Terry Edward Frye (Cary, NC)
Assignees: Tyco Electronics Corporation; Tyco Electronics Raychem GmbH
H02G1/14H02G1/1285B24B19/02B24B23/08B24B27/003
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Quick Facts
Patent No.
US 8,986,073
App. No.
13/298,915
Granted
Mar 24, 2015
Kind
B2
Abstract

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

Claims (37)

1. A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:

cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; thereafter

removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer; and

applying an electrically conductive paint composition to the first semiconductive section and the exposed polymeric insulation layer to form a conductive paint coating thereon.

2. The method of claim 1 wherein the insulation layer is formed of ethylene propylene rubber (EPR).

3. The method of claim 1 including rotating the grinding surface circumferentially around the cable while rotating the grinding surface in contact with the semiconductive layer.

4. The method of claim 1 wherein the direction of rotation of the grinding surface is transverse to a plane defined by the dividing groove.

5. The method of claim 4 wherein a portion of the grinding surface engaging the semiconductive layer rotates in a direction away from the first semiconductive section.

6. The method of claim 1 wherein the axis of rotation of the grinding surface is transverse to a lengthwise cable axis of the cable.

7. The method of claim 1 wherein the grinding surface is rounded.

8. The method of claim 1 wherein the grinding surface is formed of tungsten carbide.

9. The method of claim 1 including rotating the grinding surface using a power driver.

10. The method of claim 9 including releasable coupling the power driver and the grinding surface to the cable using a mounting tool.

11. The method of claim 1 including:

cutting a circumferential preliminary groove in the semiconductive layer using the rotating grinding surface at an axial position along the cable, the preliminary groove having a first depth; and thereafter

cutting the dividing groove into the semiconductive layer within the preliminary groove at the axial position.

12. The method of claim 1 wherein the dividing groove intersects the polymeric insulation layer.

13. The method of claim 1 wherein the first semiconductive section has a terminal edge and the dividing groove has an annular sidewall that tapers in a direction toward the terminal edge.

14. The method of claim 1 wherein the electrically conductive paint composition includes an electrically conductive material mixed with a cyanoacrylate.

15. The method of claim 14 including mixing an electrically conductive paint with the cyanoacrylate, wherein the electrically conductive paint includes a carrier and the electrically conductive material.

16. The method of claim 15 wherein the carrier is methyl ethyl ketone.

17. The method of claim 15 wherein the electrically conductive paint and the cyanoacrylate are present in a ratio of between about 10:3 to about 15:3.

18. The method of claim 14 including mixing the electrically conductive material with the cyanoacrylate to form the electrically conductive paint composition on-site in the vicinity of the polymer insulated cable.

19. The method of claim 18 including applying the electrically conductive paint composition to the polymer insulated cable within 1 minute of the step of mixing the electrically conductive material with the cyanoacrylate to form the electrically conductive paint composition.

20. The method of claim 14 including mixing a solvent with the electrically conductive material and the cyanoacrylate.

21. The method of claim 14 wherein the cyanoacrylate is ethyl-2-cyanoacrylate.

22. The method of claim 14 wherein the electrically conductive material is graphite and carbon.

23. The method of claim 1 including applying the electrically conductive paint composition to the polymer insulated cable to form a continuous coating of the electrically conductive paint overlapping both the insulation layer and the semiconductive layer.

24. A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:

cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter

removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;

wherein the direction of rotation of the grinding surface is transverse to a plane defined by the dividing groove; and

wherein a portion of the grinding surface engaging the semiconductive layer rotates in a direction away from the first semiconductive section.

25. A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:

cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter

removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;

wherein the first semiconductive section has a terminal edge and the dividing groove has an annular sidewall that tapers in a direction toward the terminal edge.

Assignments (7)
CHANGE OF NAME Recorded Jan 19, 2026
From: TYCO ELECTRONICS RAYCHEM GMBH
To: TE CONNECTIVITY ENERGY GMBH
Reel/Frame 074434/0590 →
MERGER Recorded Apr 28, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060885/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2021
From: TE CONNECTIVITY CORPORATION
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056514/0048 →
CHANGE OF ADDRESS Recorded Jun 7, 2021
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056514/0015 →
CHANGE OF NAME Recorded Jan 12, 2017
From: TYCO ELECTRONICS CORPORATION
To: TE CONNECTIVITY CORPORATION
Reel/Frame 041350/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2011
From: KEHL, LADISLAUS
To: TYCO ELECTRONICS RAYCHEM GMBH
Reel/Frame 027246/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2011
From: FRYE, TERRY EDWARD
To: TYCO ELECTRONICS CORPORATION
Reel/Frame 027246/0697 →
Continuity (2)
Provisional Application 61529065 · Aug 30, 2011
Related Publication 20130047814A1 · Feb 28, 2013