Electronic device housing and manufacturing method
An electronic device housing is disclosed. The electronic device housing, the electronic device housing comprises a cover comprising a base board, a receiving portion defined in the base board, and a fixing portion in the receiving portion; a silicone rubber membrane; and a panel received in the receiving portion, the panel is fixed to the cover via the silicone rubber membrane.
1. An electronic device housing, the electronic device housing comprising:
a cover comprising a base board, a receiving portion defined in the base board, and as fixing portion in the receiving portion;
a silicone rubber membrane; and
a panel received in the receiving portion, and the panel is fixed to the cover via the silicone rubber membrane;
wherein the receiving portion is a substantially rectangular groove, the silicone rubber membrane is affixed to the fixing portion, the panel is disposed in the receiving portion completely, and the silicone rubber membrane is configured for adhering the panel to the base board of the cover stably.
2. The electronic device housing of claim 1 , wherein the fixing portion is a fixing plane portion at a bottom surface of the receiving portion.
3. The electronic device housing of claim 1 , wherein the receiving portion is a stepped hole defined in the base board, and the fixing portion is a fixing annular portion extending from an inner sidewall of the stepped hole toward a center of the cover.
4. The electronic device housing of claim 1 , wherein the receiving portion is a stepped hole defined in the base board, and the fixing portion comprises a plurality of protrusions substantially coplanar extending from an inner sidewall of the stepped hole toward a center of the cover.
5. The electronic device housing of claim 1 , wherein the silicone rubber membrane is a rectangular thin sheet.
6. The electronic device housing of claim 1 , wherein the silicone rubber membrane is a silicone rubber film printed on the fixing portion of the cover, or a silicone rubber film printed on a surface of the panel adjacent to the cover.
7. The electronic device housing of claim 1 , wherein the cover is made of a plastic material.
8. The electronic device housing of claim 1 , wherein the cover is made of a metallic material.
9. An electronic device housing manufacturing method, the method comprising:
providing a cover with a base board, a receiving portion defined in the base board, and a fixing portion formed in the receiving portion;
adhering a silicone rubber membrane on the fixing plane portion of the cover; and
fixing a panel to the cover via the silicone rubber membrane;
wherein the receiving portion is a substantially rectangular groove, the silicone rubber membrane is affixed to the fixing, portion, the panel is disposed in the receiving portion completely, and the silicone rubber membrane is configured for adhering the panel to the base board of the cover stably.
10. The electronic device housing manufacturing method of claim 9 , wherein the silicone rubber membrane is a rectangular thin sheet.
11. The electronic device housing manufacturing method of claim 9 . wherein the silicone rubber membrane is a silicone rubber film printed on the fixing portion of the cover.
12. The electronic device housing manufacturing method of claim 9 , wherein the cover is made of a plastic material.
13. The electronic device housing manufacturing method of claim 9 , wherein the cover is made of a metallic material.