IP Library Granted Patent US 8,987,043
Granted Patent B2
US 8,987,043 · App. 13/300,176 · Granted Mar 24, 2015

Organic light emitting diode display and method for manufacturing organic light emitting diode display

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,987,043
App. No.
13/300,176
Granted
Mar 24, 2015
Kind
B2
Abstract

A method of manufacturing an OLED display includes: forming an organic light emitting element on a first substrate; forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate; providing a second substrate; forming a flexible protection layer on the second substrate; attaching the first substrate and the second substrate to each other; and separating the second substrate from the flexible protection layer.

Claims (14)

1. A method of manufacturing an organic light emitting diode (OLED) display, the method comprising:

forming an organic light emitting element on a first substrate;

forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate;

providing a second substrate;

forming a flexible protection layer on the second substrate;

forming a sacrificial layer between the second substrate and the flexible protection layer;

forming a barrier layer on the flexible protection layer;

attaching the first substrate and the second substrate to each other by attaching the barrier layer to the thin encapsulation layer; and

separating the second substrate from the flexible protection layer by removing the sacrificial layer simultaneously from both the second substrate and the flexible protection layer.

2. The method of manufacturing of claim 1 , wherein the flexible protection layer comprises resin.

3. The method of manufacturing of claim 1 , further comprising forming the first substrate on a mother board and separating the mother board from the first substrate, wherein the first substrate comprises flexible resin.

4. The method of manufacturing of claim 1 , wherein the thin film encapsulation layer comprises a single-layered inorganic layer.

5. The method of manufacturing of claim 1 , wherein the flexible protection layer comprises at least one of a polarizing film or a phase difference film.

6. The method of manufacturing of claim 1 , wherein the sacrificial layer comprises at least one of metal, amorphous material, silicon oxide, silicon nitride or metal oxide.

Assignments (2)
MERGER Recorded Aug 31, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028921/0334 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2011
From: PARK, YONG HWAN; SEO, SANG-JOON; LEE, JAE SEOB; KIM, SEUNG HUN; KIM, JIN KWANG
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 027264/0118 →