Power semiconductor package
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
1. A semiconductor package comprising:
a conductive clip having an interior surface;
a dielectric body disposed over at least a portion of said conductive clip;
at least one I/O terminal, a conductive pad, a track connecting said conductive pad to said I/O terminal, said dielectric body electrically insulating said at least one I/O terminal from said conductive clip;
a power semiconductor device having at least one power electrode electrically and mechanically connected to said conductive clip.
2. The semiconductor package of claim 1 , wherein said power semiconductor device is a power MOSFET.
3. The semiconductor package of claim 1 , wherein said power semiconductor device is an IGBT.
4. The semiconductor package of claim 1 , wherein said conductive clip is can-shaped.
5. The semiconductor package of claim 1 , wherein said conductive clip comprises copper.
6. The semiconductor package of claim 1 , wherein said conductive clip is plated with either gold or silver.
7. The semiconductor package of claim 1 , further comprising a solder resist body covering at least said track.
8. The semiconductor package of claim 1 , wherein said dielectric body comprises a polymer.