Printed matter manufacturing method, printed matter manufacturing device, and printed matter

1. A printed matter manufacturing method comprising:

forming a printed layer in a predetermined pattern on a substrate;

forming an open part penetrating through the substrate and the printed layer in an open part formation region of the printed layer; and

forming a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region,

the forming of the buffer layer including forming the buffer layer so that the buffer layer contacts a side of the printed layer opposite from a side from which formation of the open part starts, and

the forming of the buffer layer further including forming side surfaces of the buffer layer to have a tapered shape that gradually decreases in diameter toward a top surface of the buffer layer that contacts the printed layer.

2. The printed matter manufacturing method according to claim 1 , wherein

the forming of the buffer layer includes forming the buffer layer having a hardness less than that of the printed layer.

3. The printed matter manufacturing method according to claim 2 , wherein

the forming of the printed layer includes forming the printed layer having a pencil hardness of H or greater, and

the forming of the buffer layer includes forming the buffer layer having a pencil hardness of less than H.

4. The printed matter manufacturing method according to claim 1 , wherein

the forming of the buffer layer includes forming the buffer layer based on information relating to the predetermined pattern of the printed layer, and information relating to a position of the open part in the predetermined pattern.

5. The printed matter manufacturing method according to claim 1 , wherein

the forming of the printed layer and the forming of the buffer layer are performed by a droplet discharge method.

6. A printed matter manufacturing device for manufacturing a printed matter in which an open part penetrating through a substrate and a printed layer is formed in an open part formation region of the printed layer, the printed matter manufacturing device comprising:

a film formation device configured and arranged to form the printed layer in a predetermined pattern on the substrate; and

a control device configured to control the film formation device to form a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region,

the control device being configured to control the film formation device to form the buffer layer so that the buffer layer contacts a side of the printed layer opposite from a side from which formation of the open part starts, and

the control device being further configured to control the film formation device to form side surfaces of the buffer layer to have a tapered shape that gradually decreases in diameter toward a top surface of the buffer layer that contacts the printed layer.

7. The printed matter manufacturing device according to claim 6 , wherein

the control device is configured to control the film formation device to form the buffer layer having a hardness less than that of the printed layer.

8. The printed matter manufacturing device according to claim 7 , wherein

the control device is configured to control the film formation device to form the printed layer having a pencil hardness of H or greater, and the buffer layer having a pencil hardness of less than H.

9. The printed matter manufacturing device according to claim 6 , wherein

the control device is configured to control the film formation device to form the buffer layer based on information relating to the predetermined pattern of the printed layer, and information relating to a position of the open part in the predetermined pattern.

10. The printed matter manufacturing device according to claim 6 , wherein

the film formation device is configured and arranged to form the printed layer and the buffer layer by a droplet discharge method.