LED lighting assemblies with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A lighting assembly comprising:
a printed circuit board;
one or more light emitting diodes (LEDs) disposed on the printed circuit board and connectable with a power source via circuitry of the printed circuit board;
the LEDs comprised of a semiconductor chip and a lens;
a free standing thermoplastic overmolding encapsulating the printed circuit board, the thermoplastic of the freestanding thermoplastic overmolding having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K; and
a light transmissive cover disposed over one or more of the one or more LEDs, the thermoplastic overmolding encapsulating the printed circuit board and not covering at least a portion of the light-transmissive cover.
2. The lighting assembly as set forth in claim 1 , wherein the thermoplastic of the thermoplastic overmolding has a thermal conductivity greater than or about 10 W/m·K.
3. The lighting assembly as set forth in claim 1 , wherein the free standing thermoplastic overmolding does not encapsulate the one or more LEDs disposed on the printed circuit board.
4. The lighting assembly as set forth in claim 1 , wherein the free standing thermoplastic overmolding encapsulating the printed circuit board does not cover light-emitting apertures of the one or more LEDs.
5. The lighting assembly as set forth in claim 1 , wherein the lighting assembly does not include a container or housing configured to contain the free standing thermoplastic overmolding.
6. A lighting assembly comprising:
a printed circuit board;
one or more light emitting diodes (LEDs) disposed on the printed circuit board and connectable with a power source via circuitry of the printed circuit board;
a phosphor disposed in a lens overlaying the one or more LEDs; and
an overmolded housing comprising thermoplastic overmolding material encapsulating the printed circuit board; and
a light transmissive cover disposed over the one or more LEDs, the thermoplastic overmolding encapsulating the printed circuit board and not covering at least a portion of the light-transmissive cover.
7. The lighting assembly as set forth in claim 6 , wherein the phosphor coats the one or more LEDs.
8. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmolding material does not encapsulate the one or more LEDs disposed on the printed circuit board.
9. The lighting assembly as set forth in claim 6 , wherein the overmolded housing does not cover light-emitting apertures of the one or more LEDs.
10. The lighting assembly as set forth in claim 6 , wherein the lighting assembly does not include a container or housing other than the overmolded housing.
11. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmolding material has a melting temperature greater than about 100° C.
12. A lighting assembly comprising:
a printed circuit board;
more than one light emitting diodes (LEDs) including lenses disposed on the printed circuit board and connectable with a power source via circuitry of the printed circuit board; and
a free standing thermoplastic overmolding encapsulating the printed circuit board;
wherein at least one LED comprises a group III-nitride-based electroluminescent semiconductor diodes; and
a light transmissive cover disposed over more than one LED, the thermoplastic overmolding encapsulating the printed circuit board are not covering at least a portion of the light transmissive cover.
13. The lighting assembly as set forth in claim 12 , wherein the free standing thermoplastic overmolding does not encapsulate the one or more LEDs disposed on the printed circuit board.
14. The lighting assembly as set forth in claim 12 , wherein the free standing thermoplastic overmolding encapsulating the printed circuit board does not cover light-emitting apertures of the one or more LEDs.
15. The lighting assembly as set forth in claim 12 , wherein the lighting assembly does not include a container or housing configured to contain the free standing thermoplastic overmolding.
16. The lighting assembly as set forth in claim 12 , wherein the light-transmissive cover includes a phosphor.
17. The lighting assembly as set forth in claim 12 , further comprising:
a phosphor coating the one or more LEDs.
18. The lighting assembly as set forth in claim 17 , wherein the phosphor comprises one of a white-light emitting phosphor blend and a yellowish-light emitting phosphor blend.
19. The lighting assembly as set forth in claim 12 , wherein the thermoplastic of the freestanding thermoplastic overmolding has a melting temperature greater than about 100° C.