Method of manufacturing a lighting assembly with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A method of manufacturing a lighting assembly, the method comprising:
locating one or more light emitting diodes (LEDs) on a printed circuit board;
electrically and mechanically connecting the printed circuit board to a plurality of flexible electrical conductors;
disposing one or more light-transmissive covers over said one or more LEDs;
placing the circuit board with attached LEDs and flexible electrical conductors in a mold, said mold including one or more isolation regions associated with the one or more LEDs and one or more light-transmissive covers; and
insert molding an overmolding material over at least portions of the printed circuit board proximate the LEDs;
wherein the one or more isolation regions prevent an at least one aperture and a portion of the light-transmissive cover over the LEDs from being covered with overmolding material.
2. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive covers each encloses more than one LED.
3. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive covers each encloses one LED.
4. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the electrically connecting step comprises insulation displacement connectors displacing the conductor insulation and electrically connecting the flexible electrical conductors to the printed circuit board.
5. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive covers include a base region disposed on the printed circuit board and wherein the overmolding contacts the base region without fully covering the one or more light-transmissive covers.
6. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the overmolding material has a melting temperature preferably between about 100° C. and about 500° C.
7. The method of manufacturing a lighting assembly as set forth in claim 6 , wherein the overmolding material has a melting temperature more preferably between about 310° C. and about 350° C.
8. A method of manufacturing a lighting assembly wherein the method as set forth in claim 1 is repeated a plurality of times to produce a plurality of light assemblies interconnected to create LED-based lighting strings.
9. The method of manufacturing a lighting assembly as set forth in claim 1 , wherein the overmolding material has a thermal conductivity greater than 1 W/m·K.