Granted Patent B2

US 8,981,433 · App. 13/304,215 · Granted Mar 17, 2015

Abstract

Claims (13)

1. A compensation network for a radiofrequency transistor comprising first and second bonding bars for coupling to a first terminal of the RF transistor and a compensation capacitor respectively; one or more bond wires coupling the first and second bonding bars together; and a compensation capacitor formed from a first set of conductive elements coupled to the second bonding bar, the first set of conductive elements interdigitating with a second set of conductive elements coupled to a second terminal of the RF transistor, wherein each of the second set of conductive elements is coupled to the RF transistor sequentially through a first single via, a first intermediate metal layer, a second set of vias, a second intermediate metal layer and a third set of vias, the first and second bonding bars are spaced apart to define a region for placement of the compensation capacitor, the compensation capacitor occupying substantially the entire region, characterised in that the first and second bonding bars are spaced apart by a predefined distance, the predefined distance being selected such that the bond wires have a desired inductance, wherein the first set of conductive elements and the second set of conductive elements are isolated from each other by a dielectric material.

2. A compensation network according to claim 1 , wherein the first and/or second sets of conductive elements are formed in an upper metal layer disposed above a silicon substrate on which the RF transistor is formed.

3. A compensation network according to claim 2 , wherein the second set of conductive elements is coupled to the second terminal of the RF transistor by way of one or more vias and/or one or more intermediate metal layers disposed between the silicon substrate and the upper metal layer.

4. A compensation network according to claim 3 , wherein one of the intermediate metal layers extends underneath at least some of the first set of conductive elements.

5. A compensation network according to claim 3 , wherein at least some of the first set of conductive elements are coupled to a metal layer lying above, but electrically isolated from, one of the intermediate metal layers.

6. A compensation network according to claim 1 , wherein the bonding bars and/or the conductive elements are made from a metal.

7. A compensation network according to claim 1 , wherein the first terminal is the gate or drain of the RF transistor, and the second terminal is the source of the RF transistor.

8. A RF transistor module comprising a RF transistor and a first compensation network according to claim 1 , the first bonding bar of the first compensation network being coupled to one of the gate or drain of the RF transistor respectively and the second conductive elements of the first compensation network being coupled to the source of the RF transistor.

9. A RF transistor module comprising: a RF transistor and a first compensation network and a second compensation network according to claim 1 , the first bonding bar of the first compensation network being coupled to one of the gate or drain of the RF transistor respectively and the second conductive elements of the first compensation network being coupled to the source of the RF transistor, the first bonding bar of the second compensation network being coupled to the other of the gate or drain of the RF transistor respectively and the second conductive elements of the second compensation network being coupled to the source of the RF transistor.

10. A cellular base station or terrestrial broadcast station comprising an RF transistor module according to claim 8 .

11. The compensation network of claim 1 , wherein the dielectric material comprises silicon dioxide.

12. A compensation network according to claim 1 , wherein each of the second set of vias and the third set of vias comprises only three vias.

13. A compensation network according to claim 6 , wherein the metal comprises gold.

Assignments (13)