Light emitting chip package
A light emitting chip package includes a substrate, an insulation layer, a patterned electric conductive layer, a light emitting chip, an encapsulation, a plurality of thermal conductors and electrical conductors. The insulation layer is formed on a top surface of the substrate. The patterned electric conductive layer partially covers the insulation layer. The light emitting chip is arranged on the electric conductive layer. The encapsulation covers the light emitting chip and the electric conductive layer. The plurality of thermal conductors is formed at a bottom surface side of the substrate. The plurality of electrical conductors penetrates the insulation layer and connects the conductive layer with the thermal conductor. The plurality of electrical conductors is isolated from each other.
1. A light emitting chip package, comprising:
a substrate;
an insulation layer arranged on a top surface of the substrate;
a patterned electric conductive layer partially covering the insulation layer;
a light emitting chip arranged on the electric conductive layer;
an encapsulation covering the light emitting chip and the electric conductive layer;
an etch stop layer arranged on a bottom surface of the substrate, a plurality of portions of the etch stop layer in contact with a corresponding plurality of portions of the insulation layer;
a corresponding plurality of thermal conductors formed on the etch stop layer at the bottom surface of the substrate at the portions of the etch stop layer; and
a plurality of electrical conductors penetrating the insulation layer and the etch stop layer and connecting the electric conductive layer with the thermal conductors, the plurality of electrical conductors being isolated from each other;
wherein a plurality of first through holes is defined in each of the portions of the insulation layer, a plurality of second through holes is defined in each of the portions of the etch stop layer, and the number of first through holes is different from the number of second through holes; and
the plurality of electrical conductors comprises a plurality of first electrical conductor portions filled in the first through holes, respectively, and a plurality of second electrical conductor portions filled in the second through holes, respectively, and the first electrical conductor portions are in contact with corresponding second electrical conductor portions.
2. The light emitting chip package of claim 1 , wherein the patterned electric conductive layer comprises two isolated islands, the light emitting chip being mounted on the two isolated islands.
3. The light emitting chip package of claim 1 , wherein the patterned electric conductive layer comprises two first electrodes and a second electrode, the two first electrodes and the second electrode being isolated from each other, the second electrode being arranged between the two first electrodes.
4. The light emitting chip package of claim 3 , wherein the light emitting chip is arranged on the second electrode, the light emitting chip having two electrodes respectively wire bonded to the two first electrodes.
5. The light emitting chip package of claim 1 , wherein a diameter of each of the first through holes defined in the insulation layer is different from that of each of the second through holes defined in the etch stop layer, and correspondingly a diameter of each of the first electrical conductor portions arranged in the insulation layer is different from that of each of the second electrical conductor portions arranged in the etch stop layer.
6. The light emitting chip package of claim 5 , wherein a diameter of each of the first through holes defined in the insulation layer is smaller than that of each of the second through holes defined in the etch stop layer, and correspondingly a diameter of each of the first electrical conductor portions arranged in the insulation layer is smaller than that of each of the second electrical conductor portions arranged in the etch stop layer.
7. The light emitting chip package of claim 1 , wherein the number of first through holes in the insulating layer is greater than the number of second through holes in the etch stop layer, and correspondingly the number of first electrical conductor portions filled in the first through holes is greater than the number of second electrical conductor portions filled in the second through holes.