IP Library Granted Patent US 8,885,360
Granted Patent B2
US 8,885,360 · App. 13/307,942 · Granted Nov 11, 2014

Charger assembly and electromagnetic interference shield assembly

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Quick Facts
Patent No.
US 8,885,360
App. No.
13/307,942
Granted
Nov 11, 2014
Kind
B2
Abstract

An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Claims (16)

1. An electronic assembly comprising:

a first housing formed of a first conductive polymer, the first housing having a cavity;

a second housing formed of a second conductive polymer, the second housing having a cavity sized to receive the first housing therein; and

an electronic subassembly disposed within the cavity of the first housing;

wherein the electronic subassembly comprises a high voltage charger to convert alternating current to direct current to charge an automotive battery;

wherein the first housing and the second housing provide an electromagnetic interference (EMI) shield assembly;

wherein the first housing is formed of polyamide 66 with ten percent Carbon Nickel fiber to shield against high frequency EMI;

wherein the second housing is formed of polyamide 66 with thirty percent Stainless Steel fiber to shield against low frequency EMI; and

wherein the EMI shield assembly further comprises a metallic layer disposed between the first housing and the second housing.

2. The electronic assembly of claim 1 wherein the metallic layer is coated upon one of an exterior of the first housing and an interior of the second housing.

3. The electronic assembly of claim 1 wherein the metallic layer is coated upon an exterior of the first housing.

4. The electronic assembly of claim 1 wherein the metallic layer comprises aluminum foil.

5. The electronic assembly of claim 1 wherein the metallic layer comprises a steel housing.

6. The electronic assembly of claim 1 wherein the first housing shields against EMI within a range of 20 Hertz to 1.73 MHertz.

7. The electronic assembly of claim 1 wherein the second housing shields against EMI within a range of twenty to one hundred Hertz.

8. The electronic assembly of claim 1 wherein the first housing has a wall thickness of approximately one millimeter.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 5, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037702/0911 →
SECURITY INTEREST Recorded Mar 20, 2013
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 030076/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2011
From: PAVLOVIC, SLOBODAN; SHARAF, NADIR; DAFTUAR, DILIP
To: LEAR CORPORATION
Reel/Frame 027313/0257 →