Granted Patent B2

US 9,024,233 · App. 13/308,260 · Granted May 5, 2015

Abstract

Claims (44)

1. A method of cleaning a side edge of a thin film photovoltaic substrate, wherein the substrate defines a face surface terminating at a first side edge, and wherein a thin film is present on the face surface and the first side edge of the substrate, the method comprising:

transporting the substrate in a machine direction to move the substrate past a first laser source; and,

focusing a first laser beam generated by the first laser source onto the first side edge of the substrate such that the first laser beam removes the thin film present on the first side edge of the substrate, while the thin film layer on the face surface of the substrate is substantially unaffected by the first laser beam focused onto the first side edge of the substrate.

2. The method as in claim 1 , wherein the first laser beam is oriented in a cross-machine direction that is perpendicular to the machine direction.

3. The method as in claim 1 , wherein the first laser beam is focused directly onto the side edge of the substrate.

4. The method as in claim 1 , further comprising:

scanning the first laser beam in a z-direction onto the first side edge of the substrate such that the thin film is removed in the entire thickness first side edge.

5. The method as in claim 1 , further comprising:

scanning the first laser beam in the machine direction onto the first side edge of the substrate such that the thin film is removed from the entire first side edge while the substrate is transported in the machine direction.

6. The method as in claim 1 , wherein the laser beam has at least one of the following properties:

a frequency of about 980 nm to about 1070 nm;

pulsed to have a pulse length of about 5 ns to about 200 ns; and

a power of about 400 W to about 1000 W.

7. The method as in claim 6 , wherein the thin film comprises cadmium telluride.

8. The method as in claim 1 , wherein the substrate defines a quadrilateral having four outside edges, a leading edge, a trailing edge, and a second side edge, the method further comprising:

transporting the substrate in a machine direction to move the substrate past a second laser source; and,

focusing a second laser beam generated by the second laser source onto the second side edge of the substrate such that the second laser beam removes the thin film present on the second side edge of the substrate.

9. The method as in claim 8 , wherein the substrate moves past the first laser source and second laser source simultaneously.

10. The method as in claim 8 , further comprising:

rotating the substrate 90°; and,

thereafter, transporting the substrate in the machine direction past the first laser source and second laser source such that any thin film material on the leading edge and the trailing edge is removed.

11. An apparatus for cleaning a first side edge and a second side edge of a thin film photovoltaic substrate, the apparatus comprising:

a first laser source configured to focus a first laser beam;

a second laser source configured to focus a second laser beam; and,

a transport mechanism configured to move the substrate in a machine direction past the first laser source and the second laser source such that the first side edge of the substrate directly faces the first laser source and the second side edge of the substrate directly faces the second laser source;

wherein the first laser beam is connected to a first scanning mechanism configured such that the first laser beam is capable of scanning in the machine direction onto the first side edge of the substrate, and wherein the second laser beam is connected to a second scanning mechanism configured such that the second laser beam is capable of scanning in the machine direction onto the second side edge of the substrate.

12. A method of cleaning a side edge of a thin film photovoltaic substrate, wherein the substrate defines a face surface terminating at a first side edge, and wherein a thin film is present on the face surface and the first side edge of the substrate, the method comprising:

transporting the substrate in a machine direction to move the substrate past a first laser source;

focusing a first laser beam generated by the first laser source onto the first side edge of the substrate such that the first laser beam removes the thin film present on the first side edge of the substrate; and

scanning the first laser beam in a z-direction onto the first side edge of the substrate such that the thin film is removed in the entire thickness first side edge.

13. The method as in claim 12 , wherein the laser beam has at least one of the following properties:

a frequency of about 980 nm to about 1070 nm;

pulsed to have a pulse length of about 5 ns to about 200 ns; and

a power of about 400 W to about 1000 W.

14. An apparatus for cleaning a first side edge and a second side edge of a thin film photovoltaic substrate, the apparatus comprising:

a first laser source configured to focus a first laser beam;

a second laser source configured to focus a second laser beam; and,

a transport mechanism configured to move the substrate linearly in a machine direction past the first laser source and the second laser source such that the first side edge of the substrate directly faces the first laser source and the second side edge of the substrate directly faces the second laser source.

15. The apparatus as in claim 14 , wherein the first laser beam is oriented in a cross-machine direction that is perpendicular to the machine direction, and wherein the second laser beam is oriented in the cross-machine direction.

16. The apparatus as in claim 14 , wherein the first laser beam is connected to a first scanning mechanism configured such that the first laser beam is capable of scanning in a z-direction onto the first side edge of the substrate, and wherein the second laser beam is connected to a second scanning mechanism configured such that the second laser beam is capable of scanning in the z-direction onto the second side edge of the substrate.

17. The apparatus as in claim 14 , wherein the first laser beam is connected to a first scanning mechanism configured such that the first laser beam is capable of scanning in the machine direction onto the first side edge of the substrate, and wherein the second laser beam is connected to a second scanning mechanism configured such that the second laser beam is capable of scanning in the machine direction onto the second side edge of the substrate.

18. The apparatus as in claim 14 , wherein the first laser source and the second laser source are positioned across from each other in a cross-machine direction such that the substrate passes therebetween.

19. The apparatus as in claim 14 , wherein the first laser beam has a frequency of about 980 nm to about 1070 nm, and wherein the second laser beam has a frequency of about 980 nm to about 1070 nm.

20. The apparatus as in claim 19 , wherein the first laser source has a power of about 400 W to about 1000 W, and wherein the second laser source has a power of about 400 W to about 1000 W.

Assignments (8)