Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes
A three-dimensional integrated circuit device includes a first substrate having a first crystal orientation comprising at least one or more PMOS devices thereon and a first dielectric layer overlying the one or more PMOS devices. The three-dimensional integrated circuit device also includes a second substrate having a second crystal orientation comprising at least one or more NMOS devices thereon; and a second dielectric layer overlying the one or more NMOS devices. An interface region couples the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate.
1. A three-dimensional integrated circuit device comprising:
a first substrate having a first crystal orientation, and including:
at least one or more PMOS device thereon; and
a first dielectric layer overlying the one or more PMOS devices;
a second substrate having a second crystal orientation and including:
at least one or more NMOS devices thereon; and
a second dielectric layer overlying the one or more NMOS devices;
an interface region coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate;
a dielectric layer overlying the hybrid structure; and
a pressure sensing device overlying the dielectric layer, the pressure sensing device comprising:
a diaphragm device having a first surface region facing and overlying the hybrid structure and a second surface region opposite the first surface region;
at least one or more folded spring devices spatially disposed within a vicinity of the first surface region of the diaphragm device, each of the folded spring devices being operably coupled to the first surface region of the diaphragm device;
two or more electrode devices operably coupled to the first surface region;
a first cavity region provided between the first surface region and the hybrid structure, the first cavity region being substantially sealed and maintaining a predetermined environment; and
a housing member provided overlying the second surface region of the diaphragm device to form a second cavity region between the housing member and the diaphragm device, the housing member comprising one or more fluid openings to allow fluid to move between the second cavity and a region outside of the housing member.
2. The device of claim 1 wherein the interface region comprises a bonding material.
3. The device of claim 1 wherein the bonding material includes a covalent, eutectic, glass frit, SOG, Thermal compression, or fusion bonding materials.
4. The device of claim 1 further comprising one or more shallow trench isolation (STI) oxides formed to isolated adjacent transistors.
5. The device of claim 1 wherein the first crystal orientation is a (110) crystal orientation or a (111) crystal orientation.
6. The device of claim 1 wherein the second crystal orientation is a (100) crystal orientation.
7. The device of claim 1 wherein the first substrate and the second substrate form a vertical integrated CMOS integrated circuit device.
8. The device of claim 1 wherein the first substrate include single crystal silicon materials or substrate-on-insulator (SOI) materials.
9. The device of claim 1 wherein the second substrate include single crystal silicon materials or substrate-on-insulator (SOI) materials.
10. A three-dimensional integrated circuit device comprising:
a first substrate having a first crystal orientation and including:
at least one or more PMOS device thereon; and
a first dielectric layer overlying the one or more PMOS devices;
a second substrate having a second crystal orientation, and including:
at least one or more NMOS devices thereon; and
a second dielectric layer overlying the one or more NMOS devices;
an interface region coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate;
a pressure sensing device overlying the hybrid structure, the pressure sensing device comprising:
a diaphragm device having at least a first diaphragm surface region facing the the hybrid structure and a second diaphragm surface region opposite the first surface region; and
one or more spring devices spatially disposed within a vicinity of the first diaphragm surface region of the diaphragm device, each of the spring devices being operably coupled to the first diaphragm surface region of the diaphragm device;
two or more electrode devices operably coupled to the first diaphragm surface region;
at least one fluid channel formed between the two or more electrode devices, at least one of the fluid channels being in communication with the first diaphragm surface region of the diaphragm device; and
a housing member provided overlying the diaphragm device to form a cavity region between the housing member and the diaphragm device, the housing member comprising one or more first fluid openings to allow fluid to move between the cavity and a first region outside of the housing member, the one or more fluid openings being in communication with the second diaphragm surface region of the diaphragm.
11. The device of claim 10 wherein the interface region comprises a bonding material.
12. The device of claim 10 wherein the bonding material includes a covalent, eutectic, glass frit, SOG, Thermal compression, or fusion bonding materials.
13. The device of claim 10 further comprising one or more shallow trench isolation (STI) oxides formed to isolated adjacent transistors.
14. The device of claim 10 wherein the first crystal orientation is a (110) crystal orientation or a (111) crystal orientation.
15. The device of claim 10 wherein the second crystal orientation is a (100) crystal orientation.
16. The device of claim 10 wherein the first substrate and the second substrate form a vertical integrated CMOS integrated circuit device.
17. The device of claim 10 wherein the first substrate includes single crystal silicon materials or substrate-on-insulator (SOI) materials.
18. The device of claim 10 wherein the second substrate includes single crystal silicon materials or substrate-on-insulator (SOI) materials.