CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER
Disclosed is a method for fabricating a customized micro-electromechanical systems (MEMS) integrated circuit using at least one redistribution layer. The method includes steps of providing a substrate on which MEMS components are fabricated and coupling predetermined ones of the MEMS components via the redistribution traces.
1 . A method for fabricating a customized micro-electromechanical systems (MEMS) integrated circuit using at least one redistribution layer, comprising:
providing a substrate on which MEMS components are fabricated; and
coupling predetermined ones of the MEMS components via redistribution traces.
2 . The method of claim 1 further including providing an insulation layer over the redistribution traces.
3 . The method of claim 2 wherein the insulation layer is a passivation layer.
4 . The method of claim 2 further including etching openings through the insulation layer to expose predetermined connector locations on top of the redistribution traces.
5 . The method of claim 4 further including coupling connectors to the redistribution traces at the predetermined connector locations.
6 . The method of claim 5 wherein the connectors are solder bumps.
7 . The method of claim 5 wherein the connectors are copper pillars.
8 . The method of claim 4 wherein the predetermined connector locations align with conductive pads on a provided laminate to be coupled to the MEMS integrated circuit.
9 . The method of claim 1 wherein coupling predetermined ones of the MEMS components via redistribution traces results in a series coupling of the predetermined ones of the MEMS components.
10 . The method of claim 1 wherein coupling predetermined ones of the MEMS components via redistribution traces results in a parallel coupling of the predetermined ones of the MEMS components.
11 . The method of claim 1 wherein coupling predetermined ones of the MEMS components via redistribution traces results in combinations of series couplings and parallel couplings of the predetermined ones of the MEMS components.
12 . The method of claim 1 wherein the MEMS components are MEMS variable capacitors.
13 . The method of claim 1 wherein the MEMS components are MEMS metal contact switches.
14 . The method of claim 1 wherein select ones of the redistribution traces are fabricated into MEMS components.
15 . The method of claim 1 wherein select ones of the redistribution traces are fabricated into inductors.
16 . The method of claim 1 wherein select ones of the redistribution traces are fabricated into capacitors.
17 . The method of claim 1 wherein select ones of the redistribution traces are fabricated into resistors.
18 . The method of claim 1 wherein select ones of the redistribution traces are fabricated into transformers.
19 . The method of claim 1 wherein at least one other redistribution layer is usable to couple predetermined ones of the MEMS components.
20 . A MEMS integrated circuit having a redistribution layer comprising:
a substrate including MEMS components; and
redistribution traces coupling predetermined ones of the MEMS components.
21 . The MEMS integrated circuit of claim 20 further including an insulation layer over the redistribution traces.
22 . The MEMS integrated circuit of claim 21 wherein the insulation layer is a passivation layer.
23 . The MEMS integrated circuit of claim 21 further including openings through the insulation layer that expose predetermined connector locations on top of the redistribution traces.
24 . The MEMS integrated circuit of claim 23 further including connectors coupled to the redistribution traces at the predetermined connector locations.
25 . The MEMS integrated circuit of claim 24 wherein the connectors are solder bumps.
26 . The MEMS integrated circuit of claim 24 wherein the connectors are conductive pillars.
27 . The MEMS integrated circuit of claim 23 wherein the predetermined connector locations align with conductive pads on a provided laminate to be coupled to the MEMS integrated circuit.
28 . The MEMS integrated circuit of claim 20 wherein predetermined ones of the MEMS components are coupled in series via the redistribution traces.
29 . The MEMS integrated circuit of claim 20 wherein predetermined ones of the MEMS components are coupled in parallel via the redistribution traces.
30 . The MEMS integrated circuit of claim 20 wherein predetermined ones of the MEMS components are coupled in series and parallel combinations via the redistribution traces.
31 . The MEMS integrated circuit of claim 20 wherein the MEMS components are MEMS variable capacitors.
32 . The MEMS integrated circuit of claim 20 wherein the MEMS components are MEMS metal contact switches.
33 . The MEMS integrated circuit of claim 20 wherein select ones of the redistribution traces are fabricated into MEMS components.
34 . The MEMS integrated circuit of claim 20 wherein select ones of the redistribution traces are fabricated into inductors.
35 . The MEMS integrated circuit claim 20 wherein select ones of the redistribution traces are fabricated into capacitors.
36 . The MEMS integrated circuit of claim 20 wherein select ones of the redistribution traces are fabricated into resistors.
37 . The MEMS integrated circuit of claim 20 wherein select ones of the redistribution traces are fabricated into transformers.
38 . The MEMS integrated circuit claim 20 further including at least one other redistribution layer that is usable to couple predetermined ones of the MEMS components.