An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.
1. A packaging for an opto-electronic device, comprising:
a body;
a first optical transmitter die configured to emit light;
a first optical receiver die configured to receive a portion of the light emitted by the first optical transmitter die;
a conductive pad, the conductive pad having a component side and an opposing side that opposes the component side with at least one of the first optical transmitter and receiver dies being mounted on the component side of the conductive pad;
a first light guide configured to transmit light adjacent to the component side of the conductive pad, from the first optical transmitter die to the first optical receiver die;
a limiting element configured to confine the first light guide to the component side of the conductive pad when the first light guide is in liquid form prior to being hardened into solid form so as to substantially eliminate light transmission along the opposite side of the conductive pad;
an attachment layer sandwiched between the opposing side of the conductive pad and the limiting element; and
an opaque encapsulant encapsulating the first light guide and the limiting element forming the body.
2. The packaging of claim 1 , wherein the limiting element is a thin flat dielectric tape.
3. The packaging of claim 1 , wherein the limiting element is substantially reflective.
4. The packaging of claim 1 , wherein the limiting element is at least 50% larger than the first light guide.
5. The packaging of claim 1 , wherein the limiting element couples with the conductive pad to provide a surface for receiving the first light guide.
6. The packaging of claim 1 , wherein one of the first optical transmitter and receiver dies is attached directly to the conductive pad, the other one of the first optical transmitter and receiver dies is attached to the conductive pad via three layers of materials comprising an isolation layer sandwiched between two securing layers.
7. The packaging of claim 1 , comprises a second optical transmitter die and a second optical receiver die located adjacent to the component side of the conductive pad.
8. The packaging of claim 7 , wherein the second optical transmitter and receiver dies are encapsulated within the first light guide.
9. The packaging of claim 7 further comprises a second light guide encapsulating the second optical transmitter and receiver dies, wherein the second light guide is formed from liquid form before being hardened into solid form, and the second light guide is confined to the component side of the conductive pad by the limiting element.
10. The packaging of claim 9 , wherein the first and second light guides are optically isolated.
11. The packaging of claim 7 further comprises a second light guide formed from liquid form encapsulating the second transmitter and receiver dies, and a second limiting element configured to confine to the second light guide to the component side of the conductive pad.
12. The packaging of claim 1 , wherein the first optical transmitter die is attached to the conductive pad and the first optical receiver die is attached to an additional conductive pad.
13. The packaging of claim 1 , wherein the packaging forms a portion of an optocoupler.
14. The packaging of claim 1 , wherein the limiting element is made from one of the Mylar, Polyimide and Melinex material.
15. An optocoupler comprising:
a body;
a first optical transmitter die configured to emit light;
a first optical receiver die configured to receive light emitted by the first optical transmitter die;
an attachment layer;
a plurality of conductive leads, wherein at least one of the conductive leads forms a conductive pad to receive at least one of the first optical transmitter and receiver dies;
a component side of the conductive pad configured to receive at least one of the first optical transmitter and receiver die;
an opposing side of the conductive pad opposing the component side configured to receive the attachment layer;
a tape attached to the opposing side of the conductive pad through the attachment layer such that the attachment layer is sandwiched between the tape and the conductive pad;
a light guide encapsulating the first optical transmitter and receiver dies on the tape, wherein the tape is configured to confine the light guide when the light guide is in liquid form prior to being hardened into solid form so that the light guide is configured to transmit light adjacent to the component side of the conductive pad and substantially eliminate light transmission along the opposite side of the conductive pad; and
an opaque encapsulant encapsulating the light guide and the tape forming the body.
16. The optocoupler of claim 15 , wherein tape is a thin flat dielectric film.
17. The optocoupler of claim 15 , wherein the tape is substantially reflective.
18. The optocoupler of claim 15 , wherein one of the first optical transmitter die and receiver die is attached directly to the conductive pad, the other one of the first optical transmitter die and the first optical receiver die is attached to the conductive pad via three layers of materials comprising an isolation layer sandwiched between two securing layers.
19. The optocoupler of claim 15 , wherein the tape is made from one of the Mylar, Polyimide and Melinex material.
20. An opto-electronic device, comprising:
a body having an upper portion and a lower portion;
an optical transmitter die configured to emit light;
an optical receiver die configured to receive light emitted by the optical transmitter die;
a plurality of conductive leads, wherein the optical transmitter and receiver dies are mounted on at least one of the conductive leads interposed between the upper and lower portion of the body;
a light guide encapsulating the optical transmitter die and receiver dies configured to transfer light from the optical transmitter die to the optical receiver die located on the upper portion of the body;
a thin dielectric tape attached to the at least one of the conductive leads, the thin dielectric tape being configured to confine the light guide to the upper portion of the body when the light guide is in liquid form before being hardened into solid form, so as light transmission is confined to the upper portion of the body; and
an attachment layer sandwiched between the at least one of the conductive leads and the dielectric tape.