IP Library › Granted Patent US 8,476,630
Granted Patent B2
US 8,476,630 · App. 13/314,327 · Granted Jul 2, 2013

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

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Quick Facts
Patent No.
US 8,476,630
App. No.
13/314,327
Granted
Jul 2, 2013
Kind
B2
Abstract

A pattern of conductive ink is disposed on the topside of the unsingulated integrated circuits of a wafer, and, typically after wafer probing, the pattern of conductive ink is removed. The conductive ink pattern provides an electrical pathway between bond pads on an integrated circuit and large contact pads disposed on the topside of the integrated circuit. Each of the large contact pads is much greater in area than the corresponding bond pads, and are spaced apart so that the pitch of the large contact pads is much greater than that of the bond pads. In one aspect of the present invention, the conductive ink includes a mixture of conductive particles and wafer bonding thermoset plastic. In another aspect of the present invention, the conductive ink is heated and disposed on a wafer by an ink jet printing system.

Claims (24)

1. An apparatus for wafer testing, comprising:

a wafer having a plurality of integrated circuits with a patterned passivation layer disposed on the integrated circuits, the patterned passivation layer having openings therethrough, an individual opening exposing at least a portion of a corresponding integrated circuit pad;

a first conductive pattern having conductive lines with individual conductive lines having a first end and a second end, an individual conductive line being connected to a corresponding integrated circuit pad toward the first end; and

a second conductive pattern comprising one or more individual contact pads disposed over the passivation layer, an individual contact pad being connected to the corresponding conductive line toward the second end, the individual contact pad having a surface area that is greater than a surface area of the corresponding integrated circuit pad,

wherein the conductive lines and the contact pads comprise printable ink.

2. The apparatus of claim 1 , further comprising a probe structure in contact with the contact pads.

3. The apparatus of claim 1 wherein the individual contact pads are 300-500 times larger than the corresponding integrated circuit pads.

4. The apparatus of claim 1 wherein a pitch of the contact pads is larger than the pitch of the corresponding integrated circuit pads.

5. The apparatus of claim 1 , wherein at least one contact pad is capable of providing an indication of being touched by a probe.

6. The apparatus of claim 1 wherein the conductive lines and the contact pads can be washed off by a solvent.

7. An apparatus for wafer testing, comprising:

a wafer having a plurality of integrated circuits with a patterned passivation layer disposed on the integrated circuits, the patterned passivation layer having openings therethrough, an individual opening exposing at least a portion of a corresponding integrated circuit pad;

a conductive line disposed in a generally horizontal plane over the wafer, the conductive line having a first end and a second end, the conductive line being connected to a corresponding integrated circuit pad toward the first end; and

a conductive contact pad disposed over the passivation layer and being connected to the conductive line toward the second end, the contact pad having a surface area that is greater than a surface area of the corresponding integrated circuit pad,

wherein at least one of the conductive line and the contact pad is printed and is removable by a solvent that does not substantially remove the integrated circuit pad.

8. The apparatus of claim 7 , further comprising a probe in contact with the contact pad.

9. The apparatus of claim 7 wherein the contact pad is 300-500 times larger than the corresponding integrated circuit pad.

10. The apparatus of claim 7 wherein the at least one of the conductive line and the contact pad is heated and dissolved away.

11. The apparatus of claim 7 wherein the integrated circuit pad is undamaged after removing the contact pad.

12. An apparatus for wafer testing, comprising:

a wafer having a plurality of integrated circuits with a patterned passivation layer disposed on the integrated circuits, the patterned passivation layer having openings therethrough, an individual opening exposing at least a portion of a corresponding integrated circuit pad;

a first conductive pattern having conductive lines with individual conductive lines having a first end and a second end, an individual conductive line being connected to a corresponding integrated circuit pad toward the first end; and

a second conductive pattern comprising one or more individual contact pads disposed over the passivation layer, an individual contact pad being connected to the corresponding conductive line toward the second end, the individual contact pad having a surface area that is greater than a surface area of the corresponding integrated circuit pad,

wherein the conductive lines and the contact pads comprise conductive nano-particles and thermoset plastic.