Granted Patent B2

US 8,638,171 · App. 13/314,752 · Granted Jan 28, 2014

Abstract

Claims (11)

1. A radiofrequency amplifier comprising: an active device mounted on a substrate within a device package, the amplifier having an output impedance matching network comprising a high pass network provided at least partly on the active device and a low pass network having an inductance and comprising a first inductive shunt connection between an output of the active device and a first output lead and a second inductive shunt connection between the output of the active device and a second output lead, wherein a portion of the second output lead forms an inductance contributing to the inductance of the low pass network.

2. The radiofrequency amplifier of claim 1 , wherein a shunt inductance is provided by a combination of:

i) an inductance of a plurality of bond wires connecting the output of the active device with the second output lead;

ii) an inductance of a metal strip forming the second output lead; and

iii) an inductance of a transmission line provided on a PCB to which the amplifier is mounted.

3. The radiofrequency amplifier of claim 1 , wherein the second output lead comprises a transmission line disposed between the first output lead and the output of the active device.

4. The radiofrequency amplifier of claim 3 wherein the transmission line comprises a pair of parallel conductors, with a first conductor connected to a ground connection at or proximate the active device and a second conductor connected to the output of the active device.

5. The radiofrequency amplifier of claim 4 wherein the first conductor is connected to the ground connection by a connection that is soldered or glued, or by bond wire connections directly to ground, or via at least one bond pad on the active device.

6. The radiofrequency amplifier of claim 4 wherein the second conductor is connected to the output of the active device by a plurality of bond wires connecting to the second conductor through openings in the first conductor.

7. The radiofrequency amplifier of claim 1 , further comprising a series capacitor connected between an output connection and a drain connection of the active device.

8. The radiofrequency amplifier of claim 1 , further comprising a series capacitor connected to the output of the active device, the series capacitor being part of a separate die on the substrate adjacent to the active device.

Assignments (12)