Organic light emitting diode display and method for manufacturing the same

1. An organic light emitting diode (OLED) display comprising:

a substrate;

an organic light emitting element on the substrate;

a thin film encapsulation layer on the substrate and covering the organic light emitting element;

a polymer carpet layer directly on the thin film encapsulation layer, wherein the polymer carpet layer is formed by a polymerization reaction of a cross-linked biphenyl self-assembled mono-layer (SAM) and silicon (Si); and

a cover film directly on the polymer carpet layer.

2. The organic light emitting diode (OLED) display of claim 1 , wherein the polymer carpet layer comprises a plurality of substantially irregularly shaped strands.

3. The organic light emitting diode (OLED) display of claim 2 , wherein the plurality of substantially irregularly shaped strands has a tangled hair shape.

4. The organic light emitting diode (OLED) display of claim 1 , wherein one surface of the thin film encapsulation layer contacting the polymer carpet layer includes silicon (Si).

5. The organic light emitting diode (OLED) display of claim 1 , wherein one surface of the cover film contacting the polymer carpet layer has adherence.

6. The organic light emitting diode (OLED) display of claim 1 , wherein the cover film is made of an epoxy-based material.

7. A manufacturing method of an organic light emitting diode (OLED) display, comprising:

forming an organic light emitting element and a thin film encapsulation layer covering the organic light emitting element and including silicon (Si) on a substrate;

coating a monomer on a gold substrate and irradiating electrons to form a cross-linked biphenyl self-assembled mono-layer (SAM);

detecting the cross-linked biphenyl self-assembled mono-layer in a state of being adhered to the cover film from the gold substrate by using a cover film having one surface having adherence;

disposing the cross-linked biphenyl self-assembled mono-layer adhered to the cover film to contact the thin film encapsulation layer; and

irradiating the cross-linked biphenyl self-assembled mono-layer contacting the thin film encapsulation layer to polymerize the cross-linked biphenyl self-assembled mono-layer and silicon included in the thin film encapsulation layer with ultraviolet (UV) light, thereby forming a polymer carpet layer.

8. The manufacturing method of claim 7 , wherein the polymer carpet layer forms with a tangled hair shape.

9. The manufacturing method of claim 7 , wherein the monomer includes a para-nitrobiphenyl.

10. The manufacturing method of claim 7 , wherein the thin film encapsulation layer includes a silicon oxide layer or a silicon nitride layer.

11. The manufacturing method of claim 7 , wherein the cover film is made of an epoxy-based material.

12. The manufacturing method of claim 7 , wherein the cross-linked biphenyl self-assembled mono-layer detached from the gold substrate has a thickness in the range of 0.5 nm to 2 nm.