IP Library Granted Patent US 8,621,643
Granted Patent B2
US 8,621,643 · App. 13/316,517 · Granted Dec 31, 2013

Semiconductor device

Inventors: Hiroko Suyama (Yokohama, JP); Kenichiro Shibata (Yokohama, JP); Hiroki Wakamatsu (Yokohama, JP)
Assignee: Spansion LLC
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Quick Facts
Patent No.
US 8,621,643
App. No.
13/316,517
Granted
Dec 31, 2013
Kind
B2
Abstract

A semiconductor device includes a nonvolatile memory, and an interface configured to transfer data to and from the nonvolatile memory. The interface includes a security logic unit which controls a security level for the data written to the nonvolatile memory, in accordance with a plurality of preset security codes and a lock code that is written to a specific area in the nonvolatile memory.

Claims (34)

1. A semiconductor device comprising:

a nonvolatile memory; and

an interface configured to transfer data to and from the nonvolatile memory, wherein

the interface includes a security logic unit which controls a security level for the data written to the nonvolatile memory, in accordance with a plurality of preset security codes and a lock code that is written to a specific area in the nonvolatile memory, and

the security codes include a first security code and a second security code, and wherein

in a test mode for testing the semiconductor device, the security logic unit sets security ON if the first security code matches the lock code, and sets security OFF if the first security code does not match the lock code, and

in a normal mode for operating the semiconductor device, the security logic unit sets security OFF if the second security code matches the lock code, and sets security ON if the second security code does not match the lock code.

2. The semiconductor device as claimed in claim 1 , wherein the security codes further include a third security code, and wherein

in the test mode, if the first security code does not match the lock code, then the security logic unit sets security ON except for some functions if the third security code matches the lock code, and sets security OFF if the third security code does not match the lock code.

3. The semiconductor device as claimed in claim 2 , wherein if the first security code does not match the lock code, but the third security code matches the lock code, the security logic unit permits only a predetermined function to be executed.

4. The semiconductor device as claimed in claim 3 , wherein the predetermined function is a function that is executed by an initial analysis command for fault analysis of the semiconductor device.

5. The semiconductor device as claimed in claim 2 , wherein the second security code includes a code corresponding to data resulting from a total erasure of the nonvolatile memory.

6. The semiconductor device as claimed in claim 5 , wherein the first security code and the third security code are each chosen to be a code that differs from the code corresponding to the data resulting from a total erasure of the nonvolatile memory.

7. The semiconductor device as claimed in claim 2 , wherein the second security code includes a code corresponding to a test pattern used in a pre-shipment test of the nonvolatile memory.

8. The semiconductor device as claimed in claim 7 , wherein the first security code and the third security code are each chosen to be a code that differs from the code corresponding to the test pattern used in the pre-shipment test of the nonvolatile memory.

9. A semiconductor device comprising:

a nonvolatile memory; and

an interface configured to transfer data to and from the nonvolatile memory, wherein

the interface includes a security logic unit which controls a security level for the data written to the nonvolatile memory, in accordance with a plurality of preset security codes and a lock code that is written to a specific area in the nonvolatile memory, and

switching from the normal mode to the test mode is effected by entering a predetermined code from an external device.

10. The semiconductor device as claimed in claim 1 , wherein the specific area is an area to be erased last in an address space of the nonvolatile memory.

11. The semiconductor device as claimed in claim 10 , wherein the nonvolatile memory comprises a plurality of banks, and

the specific area is contained in a bank to be erased last among the plurality of banks.

12. The semiconductor device as claimed in claim 1 , wherein the security codes are each preset in the interface by burn-in using a mask at the time of manufacture or by power supply clamping.

13. The semiconductor device as claimed in claim 1 , wherein security state after startup is ON by default.

14. The semiconductor device as claimed in claim 1 , further comprising a CPU, and wherein

the data written to the nonvolatile memory is a program code for implementing a prescribed function by controlling the CPU.

15. The semiconductor device as claimed in claim 9 , wherein the specific area is an area to be erased last in an address space of the nonvolatile memory.

16. The semiconductor device as claimed in claim 15 , wherein the nonvolatile memory comprises a plurality of banks, and

the specific area is contained in a bank to be erased last among the plurality of banks.

17. The semiconductor device as claimed in claim 9 , wherein the security codes are each preset in the interface by burn-in using a mask at the time of manufacture or by power supply clamping.

18. The semiconductor device as claimed in claim 9 , wherein security state after startup is ON by default.

19. The semiconductor device as claimed in claim 9 , further comprising a CPU, and wherein

the data written to the nonvolatile memory is a program code for implementing a prescribed function by controlling the CPU.

Assignments (7)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2011
From: SUYAMA, HIROKO; SHIBATA, KENICHIRO; WAKAMATSU, HIROKI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027432/0374 →
Priority Claims (1)
JP 2011-011243 · Jan 21, 2011 · national
Continuity (1)
Related Publication 20120192282A1 · Jul 26, 2012