Optoelectronic module and method of producing an optoelectronic module
View Patent ↗An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
1. An optoelectronic module comprising:
a radiation-emitting semiconductor component,
an electrical component,
a carrier substrate comprising a top and a bottom, and
a housing in which the carrier substrate, the electrical component and the radiation-emitting semiconductor component are arranged, wherein
first electrical connections are arranged on the bottom and second electrical connections are arranged on the top,
the electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections,
the radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate,
the radiation-emitting semiconductor component comprises conductive structures electrically conductively connected with the second electrical connections,
the housing comprises radiation-absorbing particles to improve contrast by avoiding action of extraneous sunlight,
the radiation-emitting semiconductor component comprises a recess located on a mounting side of the radiation-emitting semiconductor component and the electrical component arranged in said recess, and
the radiation-emitting semiconductor component is fixed to the carrier substrate with a coupling layer located only outside a cavity of the radiation-emitting semiconductor component.
2. The optoelectronic module according to claim 1 , wherein the carrier substrate is a printed circuit board, the radiation-emitting semiconductor component is an LED and the electrical component is an IC for driving the LED.
3. The optoelectronic module according to claim 1 , wherein the conductive structures are electrically conductive webs which project from the radiation-emitting semiconductor component.
4. The optoelectronic module according to claim 3 , wherein the electrically conductive webs curve away from the radiation-emitting semiconductor component towards the carrier substrate.
5. The optoelectronic module according to claim 4 , wherein the electrically conductive webs are of L-shaped construction.
6. The optoelectronic module according to claim 4 , wherein the electrically conductive webs are of Z-shaped construction.
7. The optoelectronic module according to claim 4 , wherein the electrically conductive webs are of J-shaped construction.
8. The optoelectronic module according to claim 3 , wherein the electrically conductive webs are metal webs.
9. The optoelectronic module according to claim 1 , wherein the first electrical connections are guided through the carrier substrate by vias.
10. The optoelectronic module according to claim 1 , further comprising an encapsulation which encloses the radiation-emitting semiconductor component and which comprises radiation-absorbing particles.
11. The optoelectronic module according to claim 1 , wherein the carrier substrate is in the form of a multilayer substrate.
12. The optoelectronic module according to claim 1 , wherein
further electrical components are arranged on the top of the carrier substrate and electrically conductively connected with further first electrical connections on the bottom of the carrier substrate, and
further radiation-emitting components are each arranged on a side of an electrical component remote from the carrier substrate and electrically conductively connected with further second electrical connections on the top of the carrier substrate.
13. The optoelectronic module according to claim 1 , wherein:
the radiation-emitting semiconductor component is mounted on the conductive structures only in a peripheral area outside the cavity,
a space containing air is located between the radiation-emitting semiconductor component and the electrical component,
the electrical component and the radiation-emitting semiconductor component comprise a common center axis from a top view,
the top of the carrier substrate is planar, and
the radiation-emitting semiconductor component completely covers the electrical component.