IP Library Patent Application 13321930
Patent Application
App. No. 13/321,930

PROCESS OF FABRICATING PREPREG SHEET FOR PRINTED-WIRING BOARD AND DEVICE OF FABRICATING PREPREG SHEET FOR PRINTED-WIRING BOARD

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Quick Facts
Patent No.
US None
App. No.
13/321,930
Abstract

The present invention has been aimed to propose a process and a device of fabricating a prepreg for a printed circuit board which are capable of controlling respective thicknesses of resin layers on the opposite surfaces of a resultant prepreg, removing air bubbles from the resultant prepreg, and improving productivity. The present invention is a process of resin-coating the opposite surfaces of an elongated substrate sheet 3. The process includes the steps of: feeding the substrate sheet 3 while tensioning the same in a feeding direction along the length of the substrate sheet 3; coating, by the coating head 2 of the first dispenser 1 a, one surface of the substrate sheet 3 with the fluid resin 4 while pressing against the one surface to bend the substrate sheet 3; and subsequently coating, by the coating head 2 of the second dispenser 1 b, the other surface of the substrate sheet 3 with the fluid resin 4 while pressing against the other surface to bend the substrate sheet 3. A die coater and a roll coater can be used as the first dispenser 1 a and the second dispenser 1 b.

Claims (15)

1 . A process of fabricating a prepreg for a printed circuit board by resin-coating the opposite surfaces of an elongated substrate sheet, said process comprising the steps of:

feeding said substrate sheet while tensioning the same in a feeding direction along the length of said substrate sheet;

bending said substrate sheet at a first spot in the length thereof in a direction other than a feeding direction while dispensing and squeezing a resin fluid on one surface of said substrate sheet being bent for impregnating said substrate sheet with said resin fluid; and

subsequently bending said substrate sheet, at a second spot downstream of the first spot with regard to the feeding direction, in a direction other than the feeding direction while dispensing and squeezing a resin fluid on the opposite surface of said substrate sheet being thus bent for impregnating said substrate sheet with said resin fluid.

2 . The process as set forth in claim 1 , wherein

said process employ a first dispenser and a second dispenser each of which is configured to have a coating head extending in a width direction of said substrate sheet for pressed contact with said substrate sheet along its entire width, said coating head being formed with a spout extending in the width direction of said substrate sheet for dispensing said resin fluid on said surface of the substrate sheet being bent.

3 . The process as set forth in claim 1 , wherein

said process employs a first dispenser and a second dispenser each of which is in the form of a roller defining therearound a coating head which is held in pressed contact with said substrate sheet for transferring said resin fluid from a periphery of the roller to the surface of said substrate sheet as the roller rotates.

4 . A device of fabricating a prepreg for a printed circuit board by feeding an elongated substrate sheet while tensioning the same in a feeding direction along the length of said substrate sheet, and resin-coating the opposite surfaces of said substrate sheet, said device comprising:

a first dispenser configured to bend said substrate sheet at a first spot in the length thereof in a direction other than a feeding direction while dispensing and squeezing a resin fluid on one surface of said substrate sheet being bent for impregnating said substrate sheet with said resin fluid; and

a second dispenser configured to bend said substrate sheet, at a second spot downstream of said first spot with regard to the feeding direction, in a direction other than the feeding direction while dispensing and squeezing a resin fluid on the opposite surface of said substrate sheet being thus bent for impregnating said substrate sheet with said resin fluid.

5 . A device of fabricating a prepreg for a printed circuit board as set forth in claim 4 , wherein

each of said first dispenser and said second dispenser is a die coater.

6 . A device of fabricating prepreg used for printed-wiring boards as set forth in claim 4 , wherein

each of said first dispenser and said second dispenser is a roll coater.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
MERGER Recorded Feb 13, 2012
From: PANASONIC ELECTRIC WORKS CO.,LTD.,
To: PANASONIC CORPORATION
Reel/Frame 027697/0525 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2011
From: MATSUZAKI, YOSHINORI; FUJITA, KAZUHIKO; TASHIRO, MASAYA; KOBAYASHI, SHINYA
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 027265/0475 →