Pressure sensor mounting structure
View Patent ↗A semiconductor pressure sensor includes: a case; a pressure inlet port through which a measurement target fluid is introduced into the case; an atmosphere inlet port through which atmosphere is introduced; and a sensor chip configured to measure the pressure of the fluid with respect to atmospheric pressure. The pressure inlet port and the atmosphere inlet port are disposed on the same surface side of the case. The pressure inlet port is communicated with the inside of the case.
1. A pressure sensor comprising:
a case;
a pressure inlet port through which a fluid is introduced into the case;
an atmosphere inlet port open to ambient atmosphere; and
a sensor chip that measures the pressure of the fluid with respect to atmospheric pressure,
wherein the pressure inlet port and the atmosphere inlet port are positioned on a same side of the case,
wherein the pressure inlet port is in communication with an inside of the case, and
wherein an area of the pressure inlet port is larger than an area of the atmosphere inlet port, in a plan view.
2. The semiconductor pressure sensor according to claim 1 ,
wherein the case comprises a terminal provided on a first main surface of the case for surface-mounting the case on a mounting substrate, and
wherein the pressure inlet port and the atmosphere inlet port are disposed on a second main surface of the case which is opposite to the first main surface.
3. The pressure sensor according to claim 2 ,
wherein the atmosphere inlet port comprises an extending section provided on the second main surface, and
wherein an opening of the atmosphere inlet port is more distant from the mounting substrate than the second main surface.
4. The pressure sensor according to claim 1 ,
wherein the pressure inlet port communicates with a pressure inlet section provided on a surface of the case, and
wherein the atmosphere inlet port communicates with an atmospheric tubular pressure inlet section provided in parallel with the pressure inlet section.
5. The pressure sensor according to claim 4 ,
wherein the pressure inlet section and the atmospheric pressure inlet section are integrally provided.
6. The pressure sensor according to claim 5 ,
wherein the atmospheric pressure inlet section comprises a cut provided on a side opposite to the contact surface that contacts the pressure inlet section.
7. The semiconductor pressure sensor according to claim 5 ,
wherein the atmosphere inlet port is exposed at a side surface of the atmospheric pressure inlet section along a longitudinal direction thereof, without being exposed at a tip end of the atmospheric pressure inlet section along the longitudinal direction thereof.
8. The pressure sensor according to claim 7 ,
wherein the tip end of the atmospheric pressure inlet section is configured by comprises a member different from that of the atmospheric pressure inlet section.
9. The semiconductor pressure sensor according to claim 4 ,
wherein the pressure inlet section and the atmospheric pressure inlet section comprise contact surfaces which contact each other along an extension direction of the pressure inlet section and the atmospheric pressure inlet section, and
wherein the pressure inlet section extends to a position higher than the atmospheric pressure inlet section.
10. The pressure sensor according to claim 1 ,
wherein the sensor chip is disposed inside the case at a position which does not oppose the pressure inlet port.
11. The pressure sensor according to claim 1 ,
wherein the sensor chip and a circuit chip lie in a same plane.
12. The pressure sensor according to claim 1 ,
wherein a concave section, which is spaced from the atmosphere inlet port, is provided on a surface of the atmospheric pressure inlet section.
13. The pressure sensor according to claim 1 ,
wherein a protrusion is provided on an inclined tip end surface of the atmospheric pressure inlet section.
14. A pressure sensor comprising:
a case;
a pressure inlet port through which a fluid is introduced into the case;
an atmosphere inlet port open to ambient atmosphere; and
a sensor chip that measures pressure of the fluid with respect to atmospheric pressure,
wherein the pressure inlet port and the atmosphere inlet port are disposed on a same side of the case,
wherein the pressure inlet port is in communication with an inside of the case,
wherein the pressure inlet port is in communication with a pressure inlet section provided on a surface of the case,
wherein the atmosphere inlet port is in communication with an atmospheric pressure inlet section provided in parallel with the pressure inlet section,
wherein the pressure inlet section and the atmospheric pressure inlet section comprise contact surfaces which contact each other along an extension direction of the pressure inlet section and the atmospheric pressure inlet section, and
wherein the pressure inlet section extends to a position higher than the atmospheric pressure inlet section.
15. The pressure sensor according to claim 14 ,
wherein the case comprises a terminal, provided on a first main surface of the case, for surface-mounting the case on a mounting substrate, and
wherein the pressure inlet port and the atmosphere inlet port are disposed on a second main surface, which is opposite to the first main surface.
16. The pressure sensor according to claim 15 ,
wherein the atmosphere inlet port comprises an extending section provided on the second main surface, and
wherein an opening of the atmosphere inlet port is more distant from the mounting substrate than the second main surface.
17. The pressure sensor according to claim 14 ,
wherein the atmosphere inlet port is exposed at a side surface of the atmospheric pressure inlet section along a longitudinal direction thereof, without being exposed at a tip end of the atmospheric pressure inlet section along the longitudinal direction thereof.
18. The pressure sensor according to claim 14 ,
wherein the sensor chip and a circuit chip lie in a same plane.
19. The pressure sensor according to claim 14 ,
wherein a concave section which is spaced from the atmosphere inlet port is provided on a surface of the atmospheric pressure inlet section.
20. The pressure sensor according to claim 14 ,
wherein a protrusion is provided on an inclined tip end surface of the atmospheric pressure inlet section.
21. A pressure sensor comprising:
a case;
a pressure inlet port through which a fluid is introduced into the case;
an atmosphere inlet port open to ambient atmosphere is introduced; and
a sensor chip that measures pressure of the fluid with respect to atmospheric pressure,
wherein the pressure inlet port and the atmosphere inlet port are disposed on the same side of the case,
wherein the pressure inlet port is in communication with an inside of the case,
wherein the pressure inlet port is in communication with a pressure inlet section provided on a surface of the case,
wherein the atmosphere inlet port is in communication with an atmospheric pressure inlet section provided in the pressure inlet section, and
wherein the atmosphere inlet port is exposed at a side surface of the atmospheric pressure inlet section along a longitudinal direction thereof.
22. The pressure sensor according to claim 21 ,
wherein a tip end of the atmospheric pressure inlet section comprises a member different from that of the atmospheric pressure inlet section.
23. The pressure sensor according to claim 21 ,
wherein the case comprises a terminal provided on a first main surface of the case for surface-mounting the case on a mounting substrate, and
wherein the pressure inlet port and the atmosphere inlet port are disposed on a second main surface which is opposite to the first main surface.
24. The pressure sensor according to claim 22 ,
wherein the atmosphere inlet port comprises an extending section provided on the second main surface, and
wherein an opening of the atmosphere inlet port is more distant from the mounting substrate than the second main surface.
25. The pressure sensor according to claim 21 ,
wherein the atmosphere inlet port is exposed at a side surface of the atmospheric pressure inlet section along a longitudinal direction thereof, without being exposed at a tip end of the atmospheric pressure inlet section along the longitudinal direction thereof.
26. The pressure sensor according to claim 21 ,
wherein the sensor chip and a circuit chip lie in a same plane.
27. The pressure sensor according to claim 21 ,
wherein a concave section, which is spaced from the atmosphere inlet port, is provided on a surface of the atmospheric pressure inlet section.
28. The pressure sensor according to claim 21 ,
wherein a protrusion is provided on an inclined tip end surface of the atmospheric pressure inlet section.