Wiring method and device
View Patent ↗To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.
1. A method to permanently apply lead terminals to corresponding electrodes of a component, the method comprising:
inserting a holding jig in a frame, the component seated in a seat of the holding jig, the frame comprising at least two spaced apart frame legs maintaining at least one pair of spaced apart wires in a tensioned state;
resting a nose at one axial end of the holding jig into a sleeve pivotally mounted on the frame and then pivoting the holding jig and the sleeve so as to lower an opposite axial end of the holding jig toward the frame, thereby bringing the electrodes into substantial contact with the tensioned wires; and
attaching the pair of wires to the corresponding electrodes.
2. The method of claim 1 , further comprising orienting the holding jig relative to the frame so that the tensioned pair of wires on the frame is substantially in contact with the respective electrodes of the component seated in the holding jig.
3. The method of claim 1 , further comprising reciprocally disposing the pair of wires and the holding jig so that when one of the tensioned wires is substantially in contact with one of the electrodes, the other one of the tensioned wires is also substantially in contact with the other one of the electrodes.
4. The method of claim 1 , further comprising applying an air suction between the seat and the component to removably retain the component within the seat of the holding jig.
5. The method of claim 1 , wherein attaching the pair of wires to the corresponding electrodes comprises applying a soldering material to the electrodes and bringing the tensioned wires in contact with the soldering material.
6. The method of claim 5 , further comprising bringing the tensioned wires in contact with the soldering material at a distance from the respective electrodes of between 0 microns and about 100 microns.
7. The method of claim 5 , further comprising disposing the soldering material over the corresponding electrodes to cover at least 60% of the electrode surface.
8. The method of claim 5 , wherein the volume of the soldering material is 1 to 4 times the volume of the section of tensioned wire laying over the surface of the electrode.
9. The method of claim 5 , wherein the soldering material comprises a Sn, Pb, Ag, or In based alloy.
10. The method of claim 9 , wherein the soldering material comprises a eutectic indium alloy comprising In 97% Ag 3%.
11. The method of claim 5 , further comprising baking the soldering material at a baking temperature to permanently attach the tensioned wires to the electrodes.
12. The method of claim 11 , wherein the baking temperature is between about 118° and about 280° C.
13. The method of claim 12 , further comprising maintaining the baking temperature for a baking time of less than 2 hours when the baking temperature is between about 143° C. and about 280° C.
14. The method of claim 12 , further comprising progressively decreasing a baking time from 2 hours to 5 seconds when the baking temperature is increased from about 143° to about 280° C.
15. The method of claim 11 , wherein the baking temperature is inversely proportional to the volume of the component.
16. The method of claim 11 , wherein the soldering material comprises a soldering paste and baking comprises melting the soldering material.
17. The method of claim 11 , wherein for a component volume of less than 50 mm 3 , the baking temperature and baking time are respectively up to 280° C. and 5 seconds, for a component volume of 50 to 250 mm 3 , the baking temperature and baking time are respectively up to 180° C. and 5 minutes, while for a component volume of 250 to 1000 mm 3 , the baking temperature and baking time are respectively up to 150° C. and 60 minutes.
18. The method of claim 11 , further comprising baking the soldering material at a baking temperature of 25° to 180° C. and a baking time of 1 minute to 24 hours.
19. The method of claim 1 , wherein the electrodes comprise a Cu, Ti pad.
20. The method of claim 1 , further comprising coating the electrodes with coatings chosen from Pd, Ni, and Au.
21. The method of claim 1 , wherein the tensioned wires comprise Cu, Fe—Ni, or Zn and corresponding alloys.
22. The method of claim 1 , further comprising inserting the holding jig in the frame standing on edge and then rotating the holding jig relative to the frame until the electrodes are brought substantially in contact with the tensioned wires.