Testing in trays

1. A method of organizing a plurality of integrated circuit (IC) packages, comprising:

placing the plurality of IC packages on a first IC package tray that defines a plurality of pockets and wherein placing the plurality of IC packages on the first IC package tray comprises placing the plurality of IC packages on the first IC package tray such that each of the plurality of IC packages is held by a different one of the plurality of pockets;

providing a tray map of the first IC package tray wherein the tray map comprises a plurality of pocket data elements, each of the plurality of pockets representing a different one of the pocket data elements;

testing all of the plurality of IC packages to generate a plurality of operational state data items, each of the plurality of operational state data items indicating an operational state of a different one of the plurality of IC packages on the first IC package tray wherein testing all of the plurality of IC packages to generate the plurality of operational state data items further comprises populating the tray map with the plurality of operational state data items such that each operational state data item of the plurality of operational state data items is provided in a pocket data element of the plurality of pocket elements that represents a pocket of the plurality of pockets that held an IC package from the plurality of IC packages of which the operational state data item is indicating an operational state;

after testing all of the plurality of IC packages on the first IC package tray, sorting the plurality of IC packages based on the plurality of operational state data items.

2. The method of claim 1 , wherein placing the plurality of IC packages on the first IC package tray further comprises:

first, receiving the plurality of IC packages on a second IC package tray;

second, loading the first IC package tray and second IC package tray into a flipper such that the first IC package tray is over the second IC package tray; and

third, flipping the second IC package tray over the first IC package tray with the flipper to place the plurality of IC packages on the first IC package tray.

3. The method of claim 2 , wherein receiving the plurality of IC packages on the second IC package tray comprises receiving the plurality of IC packages on the second IC package tray in a live bug configuration.

4. The method of claim 3 , wherein flipping the second IC package tray over the first IC package tray to place the plurality of IC packages on the first IC package tray further comprises placing the plurality of IC packages in a dead bug configuration on the first IC package tray.

5. The method of claim 4 , wherein the second IC package tray is a standard IC package tray and the first IC package tray is a high-precision IC package tray.

6. The method of claim 1 , wherein testing all of the plurality of IC packages to generate the plurality of operational state data items, comprises:

positioning the first IC package tray so that a first IC package set of one or more IC packages of the plurality of IC packages are aligned with one or more test sockets;

actuating one or more plungers so that the first IC package set engages the one or more test sockets; and

performing one or more operations tests on the first IC package set so as to generate a first operational state data item set of one or more operational state data items from the plurality of operational state data items, each of the one or more operational state data items from the first operational state data item set indicating an operational state of a different one of the one or more IC packages from the first IC package set.

7. The method of claim 6 , the plurality of IC packages on the first IC package tray include one or more other IC package sets that are each of one or more other IC packages of the plurality of IC packages wherein, for each other IC package set of the other one or more IC package sets, testing all of the plurality of IC packages to generate the plurality of operational state data items, further comprises:

again, positioning the first IC package tray so that the other IC package set is aligned with the one or more test sockets;

again, actuating the one or more plungers so that the other IC package set engages the one or more test sockets; and

again, performing the one or more operations tests on the other IC package set to generate an other operational state data item set of one or more other operational state data items of the plurality of operational state data items, each of the one or more other operational state data items of the other operational state data item set indicating an operational state of one of the one or more other IC packages.

8. The method of claim 6 , wherein actuating the one or more plungers so that the first IC package set engages the one or more test sockets comprises plunging each of the one or more IC packages out of the first IC package tray to engage a different one of the one or more test sockets and wherein testing all of the plurality of IC packages to generate the plurality of operational state data items further comprises:

after performing the one or more operations tests on the first IC package set, placing the first IC package set back on the first IC package tray.

9. The method of claim 6 , wherein actuating the one or more plungers so that the first IC package set engages the one or more test sockets comprises plunging the first IC package tray toward the one or more test sockets.

10. The method of claim 6 , wherein the one or more plungers are connected to the one or more test sockets and wherein actuating the one or more plungers so that the first IC package set engages the one or more test sockets comprises plunging the one or more test sockets toward the first IC package tray.

11. The method of claim 6 , wherein the first IC package tray includes a receive side for receiving the plurality of IC packages on the first IC package tray, wherein positioning the first IC package tray so that a first IC package set of one or more IC packages of the plurality of IC packages are aligned with one or more test sockets further comprises providing the first IC package tray so that the receive side faces the one or more test sockets.

12. The method of claim 1 , wherein the plurality of pockets include a multitude of pocket sets and each of the multitude of pocket sets include one or more pockets of the plurality of pockets and wherein the method further comprises:

for each pocket set of the multitude of pocket sets, testing all of the plurality of IC packages to generate the plurality of operational state data items and populating the tray map, comprises:

positioning the first IC package tray so that the pocket set is aligned with one or more test sockets;

actuating one or more plungers so that an IC package set of one or more of the plurality of IC packages held by the pocket set engages the one or more test sockets; and

performing one or more operations tests on the IC package set to generate an operational state data item set of one or more operational state data items of the plurality of operational state data items, each of the one or more other operational state data items of the operational state data item set indicating an operational state of one of the one or more IC packages of the IC package set; and

for each operational state data item of the operational state data item set, providing the operational state data item in a pocket data element that represents a pocket of the plurality of pockets on the first IC package tray that holds an IC package of the IC package set, wherein the operational state data item indicates the operational state of the IC package of the IC package set.

13. The method of claim 1 , further comprising:

after testing all of the plurality of IC packages to generate the plurality of operational state data items, sorting the plurality of IC packages based on the plurality of operational state data items comprises sorting the plurality of IC packages using the tray map.

14. The method of claim 13 , wherein the plurality of pockets of the first IC package tray are each at a different one of a first plurality of tray locations of the first IC package tray and wherein, prior to sorting the plurality of IC packages, the method further comprises:

first, loading a second IC package tray into a flipper that already has been loaded with the first IC package tray such that the second IC package tray is over the first IC package tray, wherein the second IC package tray defines a second plurality of pockets wherein each of the second plurality of pockets are each at a different one of a second plurality of tray locations of the second IC package tray and the first plurality of tray locations of the plurality of pockets defined by the first IC package tray corresponds to the second plurality of tray locations of the second plurality of pockets defined by the second IC package tray; and

second, flipping the first IC package tray over the second IC package tray with the flipper to place the plurality of IC packages on the second IC package tray such that each of the plurality of IC packages is held by a one of the second plurality of pockets at a tray location of the second plurality of tray locations that corresponds to a tray location of the first plurality of tray locations of the first IC package tray.

15. The method of claim 14 , wherein sorting the plurality of IC packages using the tray map is from the second IC package tray.

16. The method of claim 15 , wherein the tray map has a plurality of pocket identification data items, each of first plurality of tray locations of the plurality of pockets being identified by a different one of the plurality of pocket data items whereby, since each of the second plurality of pockets at the tray location of the second plurality of tray locations correspond to the tray location of the first plurality of tray locations of the first IC package tray, the plurality of pocket identification data items also identify the second plurality of tray locations of the second plurality of pockets.

17. The method of claim 16 , wherein sorting the plurality of IC packages using the tray map comprises:

reading the pocket data elements;

picking one or more failing IC packages of the plurality of IC packages from the second IC package tray using corresponding pocket identification data items of the plurality of pocket identification data items, the one or more failing IC packages of the plurality of IC packages each corresponding to operational state data items indicating that the operational states of the one or more failing IC packages is one or more failing operational states;

placing each of the one or more failing IC packages in one or more failure areas corresponding to the one or more failure states.