MOVABLE LIGHT EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME
Provided is a light emitting diode (LED) device. The LED device may include an LED, a body on which the LED is fixed and a coil is wound, and a magnet that is located at a predetermined distance from the coil, on at least one side of the body, and that provides a magnetic force to the coil, and the body may move in a predetermined direction when a voltage is provided to the coil.
1 . A light emitting diode (LED) device, comprising:
an LED;
a body on which the LED is fixed and a coil is wound; and
a magnet located at a predetermined distance from the coil on at least one side of the body, and providing a magnetic force to the coil,
wherein the body moves in a predetermined direction when a voltage is provided to the coil.
2 . The LED device of claim 1 , wherein the LED is an LED package.
3 . The LED device of claim 1 , wherein the LED comprises:
an LED chip; and
a substrate containing the LED chip.
4 . The LED device of claim 1 , wherein the body is formed in a shape of a cylinder, and the magnet is formed in a shape that wraps around an outer side of the body.
5 . The LED device of claim 1 , wherein the coil supplies, to the LED, a provided anode voltage and a provided cathode voltage.
6 . The LED device of claim 3 , wherein the substrate comprises at least one of a ceramic, a printed circuit board (PCB), a flame resistant-4 (FR4), and a metal.
7 . The LED device of claim 3 , wherein the LED chip is mounted on the substrate based on at least one of a flip-chip bonding scheme and a wire-bonding scheme.
8 . The LED device of claim 1 , further comprising:
a metal side being formed on an outer side of the magnet.
9 . The LED device of claim 8 , wherein the metal side emits, to an outside environment, heat generated from the LED chip.
10 . The LED device of claim 8 , wherein the metal side shields against electro-magnetic interference (EMI) generated from an outside environment.
11 . A method of manufacturing a light emitting diode (LED) device, the method comprising:
forming an LED;
forming a body on which a coil is wound, and fixing the body on the LED;
forming a magnet being located at a predetermined distance from the coil, on at least one side of body, and providing a magnetic force to the coil,
wherein the body is movable in a predetermined direction when a voltage is provided to the coil.
12 . The method of claim 11 , wherein the forming of the LED comprises:
forming an LED package.
13 . The method of claim 11 , wherein:
the forming of the LED comprises forming an LED chip, and mounting the formed LED chip on a substrate; and
the fixing of the body on the LED comprises fixing the substrate on the formed body.
14 . The method of claim 13 , wherein the mounting of the LED chip on the substrate comprises:
mounting the LED chip on the substrate based on at least one of a flip-chip bonding scheme and a wire-bonding scheme.
15 . The method of claim 13 , further comprising:
forming a metal side that is formed on an outer side of the magnet,
wherein the metal side emits, to an outside environment, heat generated from the LED chip, or shields against electro-magnetic interference (EMI) generated from the outside environment.