IP Library Granted Patent US 8,220,695
Granted Patent B1
US 8,220,695 · App. 13/328,127 · Granted Jul 17, 2012

Method for bonding aluminum oxide to stainless steel

Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
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Quick Facts
Patent No.
US 8,220,695
App. No.
13/328,127
Granted
Jul 17, 2012
Kind
B1
Abstract

Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.

Claims (20)

1. A method for effectively bonding stainless steel to aluminum oxide including the steps of:

providing a first substrate of the stainless steel;

filling solder in the first substrate;

providing a second substrate of the aluminum oxide;

filling solder in the second substrate;

providing a net;

pressing the net;

locating the net between the first and second substrates to form a laminate and clamping the laminate;

locating the laminate in a vacuum oven;

increasing the temperature in the vacuum oven;

retaining the temperature in the vacuum oven; and

decreasing the temperature in the vacuum oven,

wherein the net is made of nickel.

2. The method according to claim 1 , wherein the solder filled in the first substrate is silver-copper brazing solder.

3. The method according to claim 1 , wherein the solder filled in the second substrate is silver-copper-titanium brazing solder.

4. The method according to claim 1 , wherein the pressing of the net is done by a hydraulic device operated at 300 to 500 psi for 5 to 15 minutes.

5. The method according to claim 1 , wherein the vacuum oven is operated at 10-4 to 10-6 Torr.

6. The method according to claim 1 , wherein the step of retaining the temperature in the vacuum oven includes the step of retaining the temperature in the vacuum oven at 800° C. to 1000° C.

7. The method according to claim 1 , wherein the step of decreasing the temperature in the vacuum oven includes the step of decreasing the temperature in the vacuum oven at a rate of 5 to 15° C./min.

8. The method according to claim 3 , wherein the silver-copper-titanium brazing solder includes 68.8 wt % of silver, 26.7 wt % of copper and 4.5 wt % of titanium, wherein the titanium is used for reacting with oxide to improve the wetability between the ceramics and the metal.

Assignments (2)
CHANGE OF NAME Recorded Apr 17, 2015
From: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS, BUREAU, MINISTRY OF NATIONAL DEFENSE
To: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 035453/0379 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2011
From: WEI, MING-HSIUNG; KUO, DONG-HAU; SHIUE, REN-KAE; YEH, KAI-TING
To: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS, BUREAU, MINISTRY OF NATIONAL DEFENSE
Reel/Frame 027399/0593 →
Priority Claims (1)
TW 100120281 A · Jun 10, 2011 · national