Vibrating micromechanical sensor of angular velocity

1. A vibrating micromechanical sensor of angular velocity, comprising:

at least one seismic mass;

and an associated moving electrode,

wherein the at least one seismic mass possesses a primary motion, into which it has to be activated, and, in addition to the primary motion, at least one degree of freedom in relation to a detection axis, or detection axes, essentially perpendicular to the primary motion,

wherein the at least one seismic mass is supported to a frame of a sensor component by a spring structure, and

wherein a quadrature signal, caused by the sensor, is adjusted to a desired level by a mechanical signal.

2. The sensor of angular velocity according to claim 1 , wherein a corner is etched off the spring structure.

3. The sensor of angular velocity according to claim 1 , wherein one or more compensation grooves are etched into the spring structure.

4. The sensor of angular velocity according to claim 1 , wherein one or more compensation cavities are etched into the spring structure.

5. The sensor of angular velocity according to claim 1 , wherein one or more compensation grooves or compensation cavities are etched into at least one attachment spot of the spring structure.

6. The sensor of angular velocity according to claim 5 , wherein the compensation grooves or compensation cavities are suitably dimensioned, such that they effectively straighten the end portion of a skewed spring.

7. The sensor of angular velocity according to claim 1 , wherein one of the edges of the spring structure is serrated.

8. The sensor of angular velocity according to claim 1 , wherein both edges of the spring structure are serrated.

9. The sensor of angular velocity according to claim 7 , wherein the serration is suitably dimensioned to be one-sided or asymmetrical, such that the serration twists the bending axis of the spring.

10. The sensor of angular velocity according to claim 1 , wherein the spring structure is asymmetrically designed such that the coupling from one mode of motion to another, conveyed by the spring, cancels or alleviates the coupling caused by a non-ideality due to the inclination of the groove of an etching process relative to a normal to a disk of the sensor component.

11. The sensor of angular velocity according to claim 10 , wherein the etching process is a DRIE (DRIE, Deep Reactive Ion Etching) etching process.

12. The sensor of angular velocity according to claim 1 , wherein the quadrature signal, caused by the sensor, is also adjusted to the desired level by an electrical signal.

13. A method for the manufacturing of a vibrating micromechanical sensor of angular velocity by micromechanical disk structures,

wherein the sensor of angular velocity comprises at least one seismic mass and an associated moving electrode,

wherein the at least one seismic mass possesses a primary motion, into which it has to be activated, and, in addition to the primary motion, at least one degree of freedom in relation to a detection axis, or detection axes, essentially perpendicular to the primary motion,

wherein the at least one seismic mass is supported to a frame of a sensor component by a spring structure, and

wherein a quadrature signal, caused by the sensor, is adjusted to a desired level by a mechanical signal.

14. The method according to claim 13 , wherein the etching mask is designed such, that it compensates for non-idealities occurring over the disk, caused by the manufacturing process.

15. The method according to claim 13 , wherein a DRIE etching technique (DRIE, Deep Reactive Ion Etching) is being used in the manufacturing.

16. The method according to claim 13 , wherein, in manufacturing, non-idealities of the DRIE (DRIE, Deep Reactive Ion Etching) etching process, such as the ARDE effect (ARDE, Aspect Ratio Dependent Etch rate), are being utilized.

17. The method according to claim 13 , wherein, in manufacturing, a two-stage DRIE (DRIE, Deep Reactive Ion Etching) etching process is being utilized, by which the depth of a groove, or a cavity, to be etched can be suitably dimensioned.

18. The method according to claim 13 , wherein the spring structure is asymmetrically designed such that the coupling from one mode of motion to another, conveyed by the spring, cancels or alleviates the coupling caused by a non-ideality due to the inclination of the groove of an etching process relative to a normal to a disk of the sensor component.

19. The method according to claim 18 , wherein the etching process is a DRIE (DRIE, Deep Reactive Ion Etching) etching process.

20. The method according to claim 13 , wherein the quadrature signal, caused by the sensor, is also adjusted to the desired level by an electrical signal.