Method for manufacturing thick polyimide flexible metal-clad laminate
View Patent ↗Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
1. A method for manufacturing a flexible metal-clad laminate, comprising:
(a) coating and drying a first polyamic acid solution on a metal layer to form a first polyimide precursor layer, the first polyimide precursor having a first thickness;
(b) coating and drying a second polyamic acid solution directly on the first polyimide precursor layer to form a second polyimide precursor layer directly on the first polyimide precursor layer, the second polyimide precursor layer having a second thickness, wherein the first polyamic acid solution and the second polyamic acid solution are not identical to each other;
(c) imidizing the first polyimide precursor layer and the second polyimide precursor layer simultaneously to form a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less;
(d) plasma-treating a surface of the first polyimide layer to form a surface-roughened polyimide layer having a predetermined surface roughness; and
(e) coating and drying a third polyamic acid solution on the surface-roughened polyimide layer to form a third polyimide precursor layer on the surface-roughened polyimide layer, followed by imidizing the third polyimide precursor layer to form a second polyimide layer on the surface-roughened polyimide layer, the second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less,
wherein the surface-roughened polyimide layer and the second polyimide layer have a total thickness of 30 μm to 60 μm.
2. The method of claim 1 , wherein the first thickness and the second thickness are not identical to each other.
3. The method of claim 1 , wherein the pre-determined surface roughness includes a surface roughness of 0.3 to 1.5μm.
4. The method of claim 1 , wherein further comprising coating and drying a fourth polyamic acid solution on the third polyimide precursor layer to form a fourth polyimide precursor layer on the third polyimide precursor layer before imidizing in (e).
5. A method of manufacturing a flexible metal-clad laminate using a casting method, comprising:
(a) casting and drying a first polyamic acid solution on a metal layer to form a first polyimide precursor layer, the first polyimide precursor having a first thickness;
(b) casting and drying a second polyamic acid solution directly on the first polyimide precursor layer to form a second polyimide precursor layer directly on the first polyimide precursor layer, the second polyimide precursor layer having a second thickness, wherein the first polyamic acid solution and the second polyamic acid solution are not identical to each other;
(c) imidizing the first polyimide precursor layer and the second polyimide precursor layer simultaneously to form a first polyimide layer on the metal layer, wherein the imidizing includes heating the first polyimide precursor layer and the second polyimide precursor layer to from 150° C. to 395° C., and the first polyimide layer has a coefficient of linear thermal expansion of 25 ppm/K or less;
(d) plasma-treating a surface of the first polyimide layer to form a surface-roughened polyimide layer having a predetermined surface roughness;
(e) casting and drying a third polyamic acid solution on the surface-roughened polyimide layer to form a third polyimide precursor layer on the surface-roughened polyimide layer; and
(f) imidizing the third polyimide precursor layer to form a second polyimide layer on the surface-roughened polyimide layer, wherein the imidizing includes heating the second polyimide precursor layer to from 150° C. to 395° C., and the second polyimide layer has a coefficient of linear thermal expansion of 25 ppm/K or less,
wherein the surface-roughened polyimide layer and the second polyimide layer have a total thickness of 30 μm to 60 μm.
6. The method of claim 5 , wherein the first thickness and the second thickness are not identical to each other.
7. The method of claim 5 , wherein thicknesses of the first polyimide layer and the second polyimide layer are 5 to 30 μm, respectively.
8. The method of claim 5 , wherein a surface roughness of the first polyimide layer is 0.3 to 1.5 μm, after the plasma-reating of the surface of the first polyimide layer.
9. The method of claim 5 , further comprising: (e- 1 ) casting and drying a fourth polyamic acid solution on the third polyimide precursor layer to form a fourth polyimide precursor layer on the third polyimide precursor layer before (f).