Light emitting device package and method of manufacturing the same

1. A light emitting device package comprising:

a plurality of lead frames disposed to be separated from one another;

at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device;

a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and

a lens part disposed on the body part, to cover the light emitting device.

2. The package of claim 1 , wherein the body part encapsulates the bonding wire, a side surface of the light emitting device, and a portion of an upper surface of the light emitting device, including the wire bonding pad.

3. The package of claim 1 , wherein the wire bonding pad is disposed in plural at an edge of the upper surface of the light emitting device.

4. The package of claim 1 , further comprising an encapsulant part formed in the reflective groove to cover the light emission surface.

5. The package of claim 4 , wherein the encapsulant part contains anyone of a fluorescent material, a diffusion material and a mixture thereof.

6. The package of claim 1 , further comprising a fluorescent substance layer formed on the light emission surface of the light emitting device.

7. The package of claim 1 , further comprising a heat dissipating unit disposed in a lower part of the light emitting device and disposed to be exposed to a lower part of the body part so as to discharge heat produced by the light emitting device to the outside.